LED Light Bar Heat Dissipation Body with Embedded LEDs
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Solution Overview
Problem
Existing LED light bars face complex processing due to soldering onto PCBs and struggle with heat dissipation, as natural convection within backlight modules is limited, leading to inefficient heat dissipation.
Innovation Solution
The LED light bar structure incorporates a heat dissipation body with installation holes and a drawer-like circuit board slot, where LEDs are embedded with inclined surfaces and contact points, allowing direct lateral heat dissipation through a heat dissipation frame made of thermally conductive materials, simplifying assembly and enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If LEDs are fixed onto PCBs through soldering, then electrical connection is achieved, but processing complexity increases
Solution Approach 1:
The patent merges the electrical connection function and mechanical support function into a single integrated circuit board structure with protruding contact points. These contact points serve dual purposes: providing electrical connectivity and enabling direct thermal conduction paths from LEDs to the circuit board, thereby eliminating the need for separate soldering operations while maintaining reliable electrical connection.
2Device complexity
If heat dissipation relies on natural convection, then no additional components are needed, but heat dissipation efficiency deteriorates in limited space
Solution Approach 1:
The patent introduces the circuit board as a thermal intermediary between the LEDs and the external environment. The circuit board's protruding contact points create direct thermal conduction pathways that bridge the LED heat sources to the larger thermal mass of the circuit board, which then acts as a heat sink and conduction medium to dissipate heat more effectively than natural convection alone could achieve in the limited backlight module space.
3Temperature
If LEDs are embedded in heat dissipation body, then heat dissipation efficiency improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent performs preliminary action by pre-forming the circuit board with protruding contact points that are specifically shaped and positioned to match the LED mounting requirements. The circuit board is prepared in advance with these thermal conduction features integrated into its structure, so that during assembly, the LEDs can be directly mounted onto these pre-prepared contact points without requiring high-precision embedding operations, thus reducing manufacturing precision requirements while maintaining effective thermal contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the assembly process and significantly improves heat dissipation efficiency by directly dissipating heat generated by LEDs, addressing the limitations of existing LED light bars.
Implementation Method 1
heat generated by the LEDs is directly and laterally dissipated by the heat dissipation body
Data Source
AI summary
The present invention discloses a light emitting diode (LED) light bar structure having heat dissipation function, adapted for a backlight module, and including a heat dissipation body, a plurality of light emitting diodes (LEDs), and a circuit board. The heat dissipation body has a circuit board insertion slot and is provided with a plurality of installation holes in row. The installation holes pass through the heat dissipation body, the LEDs are embedded in respective installation holes, and the circuit board is received in the circuit board insertion slot whereby the LEDs are fixed in the installations holes and electrically connect the circuit board. Accordingly, the LED light bar structure not only simplifies assembling procedures but also directly and laterally dissipate heat generated by the LEDs through a tight engagement of the LEDs and the heat dissipation body, thereby improving dissipation efficiency of the backlight module.