LED Light Bar Heat Dissipation Section for Backlight Module
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Solution Overview
Problem
High-brightness backlight modules in smart devices generate excessive heat, leading to temperature differences that cause optical films to wrinkle and result in functional failures, while conventional heat dissipation methods increase module thickness and cost.
Innovation Solution
An LED light bar with a heat dissipation section on its circuit board, including graphite or conductive metal plates, and a silica gel layer to effectively dissipate heat away from the LEDs, preventing heat from reaching the optical films.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If high brightness backlight module is used, then display brightness is improved, but heat generation increases causing optical films to wrinkle
Solution Approach 1:
The patent extracts the heat dissipation function from the conventional graphite sheet and integrates it directly into the LED light bar structure. The heat dissipation section is embedded within the circuit board at the LED mounting position, allowing heat to be conducted away from the LED immediately at its source before it can accumulate and cause wrinkling of optical films.
Solution Approach 2:
The patent applies local quality by placing the heat dissipation section specifically at the LED mounting position on the circuit board. This localized heat dissipation structure concentrates thermal management resources where heat generation is most intense, effectively reducing temperature at the critical location without requiring comprehensive thermal management across the entire backlight module.
2Temperature
If conventional graphite sheet is attached on reflector, then temperature difference is reduced, but module thickness increases
Solution Approach 1:
The patent merges the heat dissipation function with the LED light bar circuit board structure. The heat dissipation section is integrated into the circuit board itself at the LED mounting position, combining multiple functions (structural support, electrical connection, and thermal management) into a single component, thereby eliminating the need for separate graphite sheets that would increase thickness.
Solution Approach 2:
The patent transitions from a planar graphite sheet attached on the reflector surface to a three-dimensional heat dissipation section embedded within the circuit board at the LED mounting position. This spatial reconfiguration allows heat dissipation to occur from multiple directions and surfaces, improving thermal management efficiency while maintaining a compact form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces heat in the center of the LED light bar, prevents optical film wrinkling, and eliminates dark regions, enhancing the reliability and performance of the backlight module without increasing thickness or cost.
Implementation Method 1
A heat dissipation section is disposed in the first embedding section... disposes the heat dissipation section on the light bar circuit board to conduct heat of the LEDs out of the backlight module
Implementation Method 2
a silica gel layer to effectively dissipate heat away from the LEDs
Data Source
AI summary
The disclosure provides a LED light bar configured in a backlight module, including a light bar circuit board and LEDs disposed on the light bar circuit board. A long side of the light bar circuit board is defined with a nick. The nick forms a first embedding section. A heat dissipation section is disposed in the first embedding section. The disclosure further provides a backlight module, including a light guide plate disposed in a frame, further including the LED light bar configured in a backlight module. Compared with the prior art, the heat dissipation section is disposed on the light bar circuit board to conduct heat of the LEDs out of the backlight module, which reduces the heat in the center of the LED light bar and improves heat dissipation of the backlight module, further preventing the optical films from being wrinkle and dark regions appearing in the backlight module.