LED Light Board with Recessed Colloid Layer for Uniform Illumination
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Solution Overview
Problem
Conventional direct-type backlight modules with more LEDs are costly and suffer from alignment tolerances and light uniformity issues due to the use of optical films, which increase thickness and cost without achieving optimal light emission.
Innovation Solution
The LED light board incorporates a substrate with light emission areas, mini LEDs disposed at intervals, and a colloid layer with recesses that expose the substrate's upper surface, minimizing position deviations and reducing the number of LEDs needed by guiding light through a recess structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If optical films are adopted to increase light emission and improve uniformity, then light output uniformity is improved, but the thickness and cost of the backlight module increase
Solution Approach 1:
The patent removes the optical film layer from the backlight module structure and replaces it with a light guide plate that has light-reflecting structures directly integrated into its surface. This extraction of the optical film eliminates the need for multiple stacked layers while maintaining light uniformity through the reflective structures on the light guide plate.
Solution Approach 2:
The patent combines the light guiding function and the light uniformity enhancement function into a single light guide plate structure. The light-reflecting structures are integrated directly onto the light guide plate surface, merging what were previously separate components (optical film and light guide) into one unified element, thereby reducing overall thickness.
2Illumination intensity
If optical films are adopted to increase light emission and improve uniformity, then light output uniformity is improved, but the cost of the backlight module increases
Solution Approach 1:
The patent removes the expensive optical film layer and replaces it with a light guide plate featuring integrated light-reflecting structures. This extraction eliminates the need to purchase and assemble separate optical film components, reducing material costs and assembly complexity.
Solution Approach 2:
The patent changes the surface parameters of the light guide plate by adding light-reflecting structures directly to it. This parameter modification (adding reflective features to the light guide plate) replaces the need for separate optical films, simplifying the bill of materials and reducing manufacturing cost.
3Illumination intensity
If more LEDs are used in direct-type backlight modules, then light emission is improved, but the cost and alignment complexity increase
Solution Approach 1:
The patent introduces a light guide plate with light-reflecting structures as an intermediary component between the LEDs and the display surface. This intermediary structure redistributes and uniformizes the light from fewer LEDs, eliminating the need for precise alignment of multiple LEDs and optical films while maintaining good light emission and uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances light output uniformity and reduces the number of LEDs required, lowering costs while improving the light-emitting effect and mechanical durability during transportation.
Implementation Method 1
The colloid layer with recesses is configured to guide light, utilizing optical refraction and reflection principles to redirect light paths and achieve uniform light distribution across the display area
Data Source
AI summary
Provided is a LED light board including a substrate, a plurality of LEDs, and a colloid layer. The substrate has a plurality of adjacent light emission areas. These LEDs are respectively disposed on these light emission areas. The colloid layer is disposed on these light emission areas. These LEDs are disposed between the substrate and the colloid layer, and are covered by the colloid layer. The colloid layer has a plurality of recesses on each light emission area, and these recesses expose an upper surface of the substrate corresponding to these recesses. At least a portion of the recesses on each light emission area are disposed around the corresponding LED.