LED Light Engine Using Foil Tape Circuit Construction
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Solution Overview
Problem
Conventional methods for manufacturing large LED arrays are cost-inefficient and complex, especially for small to moderate volumes, due to the need for screen printing and environmentally unfriendly processes, which result in significant waste and high costs.
Innovation Solution
A thermally conductive substrate with an electrically insulating coating and a conductive foil tape is used, where light emitting diodes are secured with thermally conductive coupling agents and electrically interconnected via discrete conductive lengths of the foil tape, allowing for efficient heat dissipation and cost-effective production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional screen printing methods are used to manufacture large LED arrays, then circuit traces can be created on insulated metal substrates, but the process becomes cost-inefficient and complex for small to moderate volumes due to significant silver ink waste and high setup costs
Solution Approach 1:
The patent replaces expensive, reusable screen printing equipment and materials with inexpensive, disposable conductive foil tape. The foil tape can be easily applied and removed without specialized equipment, eliminating the need for costly screen preparation, silver ink, and complex printing machinery while achieving the same circuit trace creation function
Solution Approach 2:
The patent changes the physical state and form of the conductive material from liquid silver ink that requires curing to solid conductive foil tape that can be directly applied. This parameter change eliminates the need for drying/curing processes and reduces material waste, making the manufacturing process simpler and more cost-effective for small to moderate volumes
2Manufacturing precision
If photoetched printed circuits are used for large LED panels, then circuits can be created on substrates, but environmentally unfriendly processes become unmanageable with very large substrates
Solution Approach 1:
The patent replaces photoetched circuits that require chemical etching processes with disposable conductive foil tape that can be applied directly to the substrate. This eliminates the need for environmentally harmful chemicals, waste disposal systems, and complex photoetching equipment, making the process environmentally friendly while maintaining circuit creation capability
3Manufacturing precision
If screen printing with conductive ink is used for large LED arrays, then circuits can be formed on insulated metal substrates, but the process waste and complexity increase significantly for large substrate sizes
Solution Approach 1:
The patent replaces silver ink that is sprayed and cured with disposable conductive foil tape that is directly applied to the substrate. The foil tape contains the conductive material in a controlled, waste-free manner, eliminating overspray and curing waste associated with screen printing while reducing material costs for large substrates
Solution Approach 2:
The patent changes the conductive material from liquid ink requiring curing to solid foil tape that adheres directly to the substrate. This parameter change eliminates the waste associated with ink overspray, incomplete curing, and material degradation, achieving near 100% material utilization efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of large LED arrays at lower costs by reducing waste and simplifying the manufacturing process, making it feasible for small to moderate volumes while maintaining efficient heat management.
Implementation Method 1
a thermally conductive substrate with an electrically insulating coating disposed on the substrate and having a low thermal resistance for transferring heat to the substrate
Implementation Method 2
A plurality of light emitting diodes are secured to the coating with each of the light emitting diodes having a pair of LED electrical leads
Implementation Method 3
a coupling portion disposed on the tape portion to secure the foil tape to the coating
Data Source
AI summary
An L.E.D. lamp assembly (20) includes an electrically insulative coating (24) disposed on a thermally conductive substrate (22). A plurality of light emitting diodes (26) are secured to the coating (24) and a circuit (40) is adhesively secured to the coating (24) in predetermined spaced lengths (42) along the coating (24) to establish discrete and electrically conductive spaced lengths (42) with the light emitting diodes (26) disposed between the spaced lengths (42). LED electrical leads (32) are secured to the spaced lengths (42) of the circuit (40) to electrically interconnect the light emitting diodes (26). The circuit (40) includes a foil tape (46) having an electrically conductive tape portion (48) and a coupling portion (50) disposed on the tape portion (48) for securing the foil tape (46) to the insulated substrate (22). Heat generated by the light emitting diodes (26) is transferred through the insulative coating (24) to the electrically and thermally conductive substrate (22) for dissipating the heat.