LED Assembly Light Guiding and Reflecting Member
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Solution Overview
Problem
Light emitting diode (LED) assembly structures face challenges in protecting the light emitting chip from atmospheric deterioration and optimizing light radiation efficiency, with existing packaging methods like high-transparency epoxy reducing light extraction efficiency and secondary optical lenses being difficult to assemble and costly.
Innovation Solution
A light emitting diode assembly structure incorporating a light guiding member and a reflecting member, where the light guiding member directs light emitted by the chip towards the reflecting surface, which is designed with various surface shapes to enhance light reflection and distribution, and may include a substrate with additional reflecting surfaces to enlarge the illuminating range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-transparency epoxy resin is used to seal the light emitting chip, then the chip is protected from atmospheric deterioration, but the light extraction efficiency is reduced
Solution Approach 1:
The patent changes the material parameter from conventional epoxy resin to silicone-based material, which has different optical properties including lower absorption coefficient and better light transmission characteristics, thereby reducing light energy loss while maintaining protective sealing function
Solution Approach 2:
The patent uses composite material structure combining silicone base material with specific additives or fillers to achieve both protective sealing and optimized optical properties, creating a material that simultaneously provides environmental protection and enhanced light extraction
2Illumination intensity
If a secondary optical lens is arranged on the light emitting diode to change light emitting angles, then light distribution is improved, but the assembly becomes more complex and costly
Solution Approach 1:
The patent merges the protective sealing function and the optical shaping function into a single integrated silicone component, eliminating the need for separate secondary optical lenses and reducing assembly complexity while maintaining light distribution control
Solution Approach 2:
The silicone material serves multiple functions simultaneously: it provides environmental sealing protection, acts as a light guiding member to direct light emission, and functions as an optical lens to control light angles, replacing multiple separate components with a single multi-functional element
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves light irradiation efficiency and enlarges the irradiation range by effectively guiding and reflecting light emitted by the LED chip, overcoming the limitations of traditional packaging methods and enhancing the chip's protection and illumination performance.
Implementation Method 1
a light guiding member and a reflecting member, where the light guiding member directs light emitted by the chip towards the reflecting surface
Implementation Method 2
the reflecting member is arranged over the light guiding member... the first reflecting surface faced towards the light emitting chip... facilitate to the light emitted by the light emitting chip changing a light guiding path and a light pattern
Data Source
AI summary
A light emitting diode assembly structure includes a light emitting chip, a color converting layer, a light guiding member, and a reflecting member. The color converting layer coats the light emitting chip and the light guiding member coats the color converting layer. The planar or non-planar reflecting member is arranged over the light guiding member. The reflecting member faces toward the light emitting chip and changes the range of illumination of the light emitted by the light emitting chip. The reflecting member can be arranged on a side of the color converting layer and light can be irradiated towards the exterior of the light emitting diode assembly structure.