LED Light with High-Dielectric Housing for Shock Hazard Reduction

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

LED-based fluorescent tube replacement lights with exposed metal heat sinks pose a shock hazard during installation due to high-frequency starting voltage from ballasts, which can cause parasitic capacitive coupling and electrical shock to installers.

Innovation Solution

A tubular housing made of high-dielectric material is used to encase the LED-based light, with a thermally conductive heat sink and circuit board configuration that isolates the heat sink from the ambient environment, preventing capacitive coupling and reducing the risk of electrical shock, while maintaining effective thermal management of heat generated by the LEDs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If an exposed metal heat sink is used in LED-based lights, then thermal management is improved, but electrical shock hazard increases due to parasitic capacitive coupling with the circuit board

Engineering Contradiction:
Improveheat dissipationVSAvoidelectrical shock hazard
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent divides the heat dissipation function from the electrical conduction path by using separate thermally conductive but electrically insulating components. The circuit board is segmented from the heat sink structure, with thermal interface materials providing heat transfer while electrical insulation prevents capacitive coupling and shock hazards.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces thermally conductive adhesive layers and electrically insulating barriers as intermediary elements between the circuit board and heat sink. These intermediaries transfer heat effectively while blocking the electrical coupling pathway that causes parasitic capacitance and shock hazards.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If a high-dielectric material housing is used to prevent capacitive coupling, then electrical safety is improved, but thermal conduction path is worsened

Engineering Contradiction:
Improvecapacitive coupling preventionVSAvoidheat transmission
Core Design Contradiction:
Object-affected harmful factorsVSTemperature

Solution Approach 1:

The patent segments the thermal management system into multiple specialized components: the circuit board, thermally conductive adhesive layers, electrically insulating barriers, and external heat sinks. This segmentation allows each component to optimize its specific function without compromising the other.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent employs composite material structures combining thermally conductive and electrically insulating properties. Thermally conductive adhesive materials with electrical insulation characteristics are used to create pathways that preferentially conduct heat while blocking electrical current and capacitive coupling.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution eliminates the shock hazard associated with LED-based lights by using a high-dielectric tubular housing to prevent capacitive coupling, ensuring safe installation and efficient heat dissipation, thus providing a safer and effective LED-based lighting solution for replacing conventional fluorescent lights.

Implementation Method 1

the high-frequency starting voltage can cause parasitic capacitive coupling between the circuit board and the heat sink, thereby producing a charge in the heat sink

Methodology Applied
Scientific EffectParasitic capacitive coupling: Capacitance

Implementation Method 2

a tubular housing formed of a high-dielectric material

Methodology Applied
Scientific EffectDielectric: Dielectric

Implementation Method 3

the circuit board mounted in thermally conductive relation to the circuit board mounting surface, substantially all of the radially outer surface of the heat sink in thermally conductive relation with the tubular housing for electrically insulated thermal transmission of heat generated by the at least one LED

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8807785B2Electric shock resistant L.E.D. based light
Publication Date: 2014.08.19 ILUMISYS INC
  • US8807785B2 patent drawing
  • US8807785B2 patent drawing
  • US8807785B2 patent drawing

AI summary

An LED-based light comprises: a tubular housing formed of a high-dielectric material and defined at least in part by a light transmitting portion; an elongate circuit board disposed within the housing; at least one LED mounted on the circuit board; an elongate heat sink disposed within the housing, the heat sink having an interior circuit board mounting surface opposing a radially outer surface, the circuit board mounted in thermally conductive relation to the circuit board mounting surface, substantially all of the radially outer surface of the heat sink in thermally conductive relation with the tubular housing for electrically insulated thermal transmission of heat generated by the LED from the circuit board to an ambient environment surrounding the LED-based light; and a pair of end caps disposed on opposing ends of the housing with connectors configured to physically connect the LED-based light to a conventional fluorescent light fixture.