LED Light Structure with Direct Metal Base Mounting
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Solution Overview
Problem
Conventional LED heat dissipation methods are inefficient due to excessive heat absorption by intermediate media, leading to reduced heat dispersal and increased costs from using aluminum substrates.
Innovation Solution
An LED light structure with a protruding portion and a metal fixing base featuring a through trough and thread for direct, tight embedding, minimizing intermediate media and enhancing heat sinking efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional LED heat dissipation uses aluminum substrate and heat sink fin with multiple media layers, then the structure is more complete, but heat dissipation efficiency decreases due to heat absorption by intermediate media
Solution Approach 1:
The patent removes the aluminum substrate from the heat dissipation path, extracting the problematic intermediate media that absorbs heat. The LED is directly mounted on the heat sink fin through a fixing base, eliminating the unnecessary layer that was causing heat loss and structural complexity.
Solution Approach 2:
The patent merges the LED mounting function and heat dissipation function into a single integrated structure. The fixing base directly connects the LED to the heat sink fin, combining what were previously separate components (LED, aluminum substrate, heat sink) into a streamlined assembly that improves heat transfer efficiency.
2Ease of manufacture
If conventional LED uses aluminum substrate soldering method, then the LED is securely mounted, but manufacturing cost increases due to expensive aluminum substrate and soldering materials
Solution Approach 1:
The patent replaces the expensive aluminum substrate with a more cost-effective fixing base that achieves the same mounting function. The fixing base uses simpler materials and construction methods while maintaining secure LED attachment, significantly reducing material costs without compromising reliability.
3Temperature
If conventional LED structure uses multiple intermediate media for heat transfer, then the thermal path is more complete, but heat transfer efficiency decreases due to heat absorption by each media layer
Solution Approach 1:
The patent extracts and removes the aluminum substrate from the thermal path, reducing the number of media layers from multiple (LED, solder, aluminum substrate, heat sink) to minimal (LED, fixing base, heat sink). This extraction eliminates the heat-absorbing intermediate layer and improves overall heat transfer efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration simplifies the structure, reduces manufacturing costs, and effectively disperses heat from the LED light through a high-efficiency metal base, improving heat dissipation while reducing the number of media layers between the radiator and heat sink.
Implementation Method 1
the heat generated by the LED light can be completely dispersed through the fixing base
Data Source
AI summary
An LED light structure with combination device has at least including plural LED lights and plural fixing bases, wherein the LED light having a protruding portion mounted at one side thereof and the protruding portion having a thread mounted thereon for fixing with the fixing base which is a metal base with high heat sinking efficiency, and the fixing base has a through trough with a thread mounted thereinside, which is matching to the thread on the protruding portion of the LED light, so as to screw with the protruding portion of the LED light in a tight matching. Here, the protruding portion of the LED light can be a T shaped track and the fixing base can correspondingly have a T shaped trough matching to the shape of the protruding portion of the LED light, so that the LED light and the fixing base can be tightly embedded together.