LED Light Source Assembly Heat Dissipation via Integrated Metallic Substrate
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Solution Overview
Problem
LED light source assemblies generate significant heat, requiring bulky and expensive heat sinks, which increase the weight and cost of LED lamps, while existing solutions fail to efficiently dissipate heat without these sinks.
Innovation Solution
An LED light source assembly with a cylindrical structure that integrates electrodes and LED light bars connected through plastic connectors and electrical wires, utilizing a heat conduction mechanism that allows for efficient heat dissipation without a traditional heat sink, featuring a pin and socket assembly for easy connection and ventilation holes for airflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is used to dissipate heat from the LED, then the heat dissipation effect is improved, but the volume, weight, and cost of the LED lamp increase
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional heat sink component and integrates it into the LED light source board structure itself. The light source board is designed with a thin metallic substrate that directly contacts the LED chips, eliminating the need for a separate bulky heat sink while maintaining effective heat dissipation.
Solution Approach 2:
The patent merges the heat dissipation function with the electrical connection function by integrating the heat dissipation structure into the LED light source board. The metallic substrate serves both as the electrical circuit carrier and as the heat dissipation path, combining multiple functions into a single integrated component.
2Temperature
If a heat sink is used to dissipate heat from the LED, then the heat dissipation effect is improved, but the cost of the LED lamp increases
Solution Approach 1:
The patent removes the separate heat sink component from the assembly, extracting its heat dissipation function and embedding it directly into the LED light source board structure. This eliminates the need for additional heat sink materials and assembly steps, reducing manufacturing cost.
Solution Approach 2:
The metallic substrate of the LED light source board is designed to perform multiple functions simultaneously: electrical connection, structural support, and heat dissipation. This multi-functionality eliminates the need for separate dedicated heat dissipation components, thereby reducing overall manufacturing cost.
3Illumination intensity
If the LED power is increased, then the illumination intensity is improved, but the heat generation increases requiring a larger heat sink
Solution Approach 1:
The patent applies local quality by designing the heat dissipation path to be optimized at the specific location where the LED chips are mounted. The thin metallic substrate provides high thermal conductivity precisely where needed, concentrating heat dissipation capability at the heat generation source rather than requiring a uniformly large heat sink volume.
Solution Approach 2:
The patent extracts the heat dissipation function from the bulk heat sink and concentrates it into the integrated light source board structure. This allows high-power LED illumination without requiring proportionally large heat sink volume, as the heat dissipation path is built into the compact board structure itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables effective heat dissipation, reducing the need for large heat sinks, resulting in a lighter, less expensive, and more efficient LED lamp with improved airflow for heat transfer, addressing the heat management issues in LED light source assemblies.
Implementation Method 1
utilizing a heat conduction mechanism that allows for efficient heat dissipation without a traditional heat sink
Implementation Method 2
featuring a pin and socket assembly for easy connection and ventilation holes for airflow
Data Source
AI summary
An LED light source assembly and a high-power lamp using the LED light source assembly is provided, wherein, the LED light source assembly includes a LED light source board and an electric connector. The LED light source board is provided with two electrodes which are arranged in the longitudinal direction of the LED light source board and parallel to each other, and one end of the electric connector is provided with a pin assembly and another end of the LED light source board is provided with a socket assembly to make one end of the LED light source board in the longitudinal direction connected to one side of the electric connector, and another end of the rolled LED light source board in the longitudinal direction of the LED light source board is connected to another side of the electric connector.