LED Light Source Assembly Embedding Metal Substrate in Plastic Heat Sink

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Solution Overview

Problem

Existing light source assemblies for ceiling lamps face challenges in balancing safety, performance, and cost, as they often require increased heat dissipation areas which lead to higher costs and potential safety issues due to the use of resin circuit boards with low heat conductivity.

Innovation Solution

Incorporating a plastic heat-dissipating member with an embedding groove and a metal substrate embedded within it, which allows for effective heat dissipation without the need for enlarged wiring or additional components, thereby maintaining a compact layout and reducing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If resin circuit boards are used for safety, then safety is improved, but heat dissipation performance deteriorates leading to reduced service life

Engineering Contradiction:

ImprovesafetyVSAvoidheat dissipation performance

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent combines the circuit board function and heat dissipation function into a single integrated metal substrate. The metal substrate serves dual purposes: providing electrical connectivity for LED mounting and acting as a heat sink to dissipate thermal energy, thereby resolving the contradiction between safety (insulation) and heat dissipation performance.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent employs a composite structure consisting of a metal substrate with specific thermal and electrical properties. This composite material approach allows the circuit board to simultaneously achieve good electrical conductivity for circuit functionality and high thermal conductivity for heat dissipation, while maintaining safety through proper insulation design.

Inventive Principle:

Principle #40Composite materials

2Temperature

If the use area of resin PCB is increased to dissipate heat, then heat dissipation is improved, but wiring area increases resulting in large cost increase

Engineering Contradiction:

Improveheat dissipationVSAvoidcost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The metal substrate performs multiple functions simultaneously: it serves as the circuit board for electrical connections, as a heat sink for thermal management, and as a structural support for LED mounting. This multi-functionality eliminates the need for separate heat dissipation components, thereby reducing material costs and simplifying manufacturing while achieving effective heat dissipation.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the circuit board and heat dissipation components into a single integrated metal substrate structure. This consolidation reduces the total component count, minimizes wiring complexity, and lowers manufacturing costs while maintaining effective heat dissipation performance.

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If metal substrate is embedded in plastic heat-dissipating member, then heat dissipation efficiency is improved, but structural complexity increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidstructural complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent divides the heat dissipation system into two distinct but integrated components: a metal substrate for electrical and structural functions, and a plastic heat-dissipating member for thermal management. The embedding groove design allows these segments to be assembled together, achieving efficient heat dissipation while maintaining relatively simple manufacturing processes for each component.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The metal substrate is embedded within the plastic heat-dissipating member, creating a nested structure where one component is housed within another. This nesting approach maximizes heat dissipation efficiency by ensuring intimate thermal contact between the metal substrate and the plastic heat sink, while the integrated design minimizes the number of separate parts and assembly steps.

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution ensures safety and performance by efficiently dissipating heat while maintaining a compact layout for LED light sources, effectively balancing safety, performance, and cost without the need for additional wiring or enlarged components.

Implementation Method 1

the metal substrate is embedded in the embedding groove and is in contact with a groove wall of the embedding groove

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11536427B2Ceiling lamp, LED light source module, and light source assembly

Publication Date: 2022.12.27 OPPLE LIGHTING CO LTD

AI summary

A ceiling lamp, an LED light source module, and a light source assembly are provided. The light source assembly includes a plastic heat-dissipating member and a metal substrate for mounting LED light sources of the ceiling lamp. The plastic heat-dissipating member includes an embedding groove, and the metal substrate is embedded in the embedding groove and is in contact with groove walls of the embedding groove. The light source assembly can effectively balance safety, performance and cost.