LED Light Source Unit with Damming Grooves for Wire Bonding
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Solution Overview
Problem
Existing light source units with LED elements suffer from poor wire connections due to solder overflow, which hinders high-density LED arrangement and efficient cooling, leading to inadequate ultraviolet light irradiation and reduced luminous efficacy during rapid printing processes.
Innovation Solution
Incorporating damming grooves between adjacent LED elements on strip-like wirings to create non-effusion regions, where solder does not flow, allowing for reliable wire connections and higher LED density without compromising cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If LED elements are arranged in high density on strip-like wirings, then ultraviolet light irradiation intensity is improved, but solder overflow causes poor wire connections
Solution Approach 1:
The strip-like wiring is segmented into multiple regions by forming groove structures between adjacent LED elements. These grooves divide the wiring surface into distinct soldering zones and wire bonding zones, preventing solder from flowing into the wire connection areas while maintaining high LED density for sufficient UV irradiation.
Solution Approach 2:
Different regions of the strip-like wiring are given different properties: areas near LED elements have groove structures to prevent solder overflow, while other areas maintain good electrical conductivity for wire connections. This local differentiation allows simultaneous achievement of reliable connections and high irradiation intensity.
2Productivity
If LED elements are arranged in high density, then productivity is improved, but cooling efficiency deteriorates
Solution Approach 1:
The strip-like wiring is segmented into multiple regions by forming groove structures between adjacent LED elements. These grooves divide the wiring surface into distinct soldering zones and wire bonding zones, preventing solder from flowing into the wire connection areas while maintaining high LED density for sufficient UV irradiation.
Solution Approach 2:
Different regions of the strip-like wiring are given different properties: areas near LED elements have groove structures to prevent solder overflow, while other areas maintain good electrical conductivity for wire connections. This local differentiation allows simultaneous achievement of reliable connections and high irradiation intensity.
3Reliability
If solder is used to connect LED elements to strip-like wirings, then electrical connection is achieved, but solder overflow prevents wire bonding
Solution Approach 1:
The strip-like wiring is segmented into multiple regions by forming groove structures between adjacent LED elements. These grooves divide the wiring surface into distinct soldering zones and wire bonding zones, preventing solder from flowing into the wire connection areas while maintaining high LED density for sufficient UV irradiation.
Solution Approach 2:
The groove structures extract or remove the problematic solder overflow from the wire bonding areas. By creating physical barriers (grooves) that channel solder away from critical wire connection zones, the manufacturing process becomes easier and more reliable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution prevents poor connections and allows for a higher LED density arrangement, ensuring sufficient ultraviolet light irradiation and maintaining luminous efficacy by preventing solder overflow and ensuring effective heat radiation.
Implementation Method 1
An LED element is becoming popular as the light source that emits light in an ultraviolet range (UV range)
Implementation Method 2
A UV ink droplet injected from the ink jet head 21 and adhering to the surface of the print medium M is cured by the ultraviolet light emitted from the light source unit(s) 22
Implementation Method 3
A plurality of LED elements 13 are connected to each of the strip-like wirings 12 by soldering
Implementation Method 4
The heat generated from the LED elements 13 is radiated from the heat sink HS via the substrate 1
Implementation Method 5
A heat sink HS is provided in contact with a lower face of the substrate 1
Data Source
AI summary
A light source unit includes a plurality of LED elements disposed on a plurality of band-shaped wirings on a substrate. The LED elements on one band-shaped wiring are electrically connected by wires to an adjacent band-shaped wiring. The LED elements are disposed on the substrate in a staggered arrangement as a whole. The LED elements can be densely disposed without poor connection occurring in the wires connected to the band-shaped wirings, and effective cooling can be carried out without impeding the dissipation of heat from the LED elements. One or more damming channels are formed between each two adjacent LED elements on each band-shaped wiring. A non-effusion region is formed, into which no solder flows, between each two adjacent LED elements. The wires are connected to the non-effusion regions.