LED Light Source Heat Dissipation Structure for LCD Backlight
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Solution Overview
Problem
Light-emitting diodes (LEDs) in liquid crystal display (LCD) backlight units face efficiency reduction due to heat generation, as they have low heat resistance and inadequate heat dissipation, affecting operational efficiency and display quality.
Innovation Solution
A heat-dissipating structure comprising a heat-dissipating plate, heat-dissipating pins, and a power-transmitting part is integrated into the light source and backlight unit, with a housing and insulating adhesive to effectively dissipate heat generated by the LEDs, enhancing heat transfer through a combination of heat-dissipating layers and pins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If LEDs are used as light sources in backlight units, then energy efficiency and light output are improved, but heat generation increases and light-emitting efficiency decreases
Solution Approach 1:
The patent combines multiple heat dissipation mechanisms into a unified structure: the heat-dissipating plate integrates with the housing to form a combined thermal management system, while heat-dissipating pins extend from the plate to enhance surface area for heat transfer to the surrounding air and housing structure
Solution Approach 2:
The patent transitions from two-dimensional heat dissipation (flat mounting surface) to three-dimensional heat dissipation by adding vertically extending heat-dissipating pins that increase the heat transfer surface area in the vertical dimension, enabling more effective thermal management
2Illumination intensity
If multiple LEDs are mounted on a PCB in a direct illumination BLU, then light output is improved, but heat accumulation increases and affects operational efficiency
Solution Approach 1:
The patent introduces a heat-dissipating plate as an intermediary thermal management component between the LED mounting surface and the housing, serving as a heat transfer medium that conducts heat away from the LEDs and distributes it across the plate and pins for efficient dissipation
3Temperature
If heat dissipation structures are added to the light source, then thermal management is improved, but device complexity increases
Solution Approach 1:
The patent makes the housing serve multiple functions: it provides mechanical support for the LEDs, acts as a thermal management component through integrated heat-dissipating pins, and serves as the outer protective enclosure. The heat-dissipating plate similarly performs both structural support and heat conduction functions
Solution Approach 2:
The patent merges the heat dissipation function with the existing housing structure by integrating heat-dissipating pins directly into the housing, eliminating the need for separate heat sink components and reducing overall device complexity while maintaining effective thermal management
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced heat-dissipation structure significantly improves the light-emitting efficiency of LEDs, reducing thermal impact and maintaining display quality by efficiently dissipating heat away from the light-emitting chips.
Implementation Method 1
a heat-dissipating plate, a heat-dissipating pin protruding from the heat-dissipating plate... The enhanced heat-dissipation structure significantly improves the light-emitting efficiency of LEDs, reducing thermal impact
Data Source
AI summary
A light source includes a heat-dissipating plate, a heat-dissipating pin protruding from the heat-dissipating plate, a light emitting chip for emitting light, and a housing surrounding the light emitting chip, the housing having a receiving space spanning from a top surface to a bottom surface of the housing, wherein the heat-dissipating plate is disposed on the bottom surface of the housing, wherein the light emitting chip is disposed on the heat-dissipating plate exposed by the receiving space.