LED Light Source Module Fabrication via Merged Electrode Alignment

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Solution Overview

Problem

Existing light source modules, such as those using incandescent bulbs and fluorescent lamps, have short lifespans and environmental concerns, while conventional LED modules face challenges in manufacturing efficiency and cost-effectiveness due to complex fabrication processes.

Innovation Solution

A light source module with a conductive layer, insulating layer, and protective layer is designed, featuring a heat sink for heat dissipation, an insulating layer for electrical insulation, and a protective layer to prevent oxidation and external damage, allowing for rapid and cost-effective fabrication and improved product yield.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a conventional fabrication process with multiple layers and patterns is used, then manufacturing precision is improved, but device complexity and manufacturing cost increase

Engineering Contradiction:
Improvealignment precisionVSAvoidfabrication process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent combines the alignment mark and the electrode pattern into a single integrated structure. The alignment mark is formed as part of the first electrode pattern, eliminating the need for separate alignment mark fabrication steps. This merging reduces the number of lithography and etching processes while maintaining precise alignment between stacked electrodes, thereby reducing device complexity without sacrificing manufacturing precision.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The first electrode pattern serves multiple functions: it acts as both the functional electrode for applying voltage to the light emitting element and as the alignment mark for positioning subsequent layers. This multi-functionality eliminates the need for dedicated alignment marks, reducing the number of fabrication steps and simplifying the overall manufacturing process while ensuring precise alignment.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Manufacturing precision

If multiple fabrication steps are used to ensure proper layer alignment, then manufacturing precision is improved, but productivity decreases

Engineering Contradiction:
Improvelayer alignmentVSAvoidfabrication speed
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The alignment mark and first electrode pattern are fabricated in a single lithography and etching step. This eliminates multiple sequential fabrication steps that would otherwise be required to create separate alignment marks and electrodes, thereby maintaining precise layer alignment while significantly improving fabrication speed and productivity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The alignment mark is pre-integrated into the electrode pattern design, so that alignment functionality is built-in from the beginning of the fabrication process. This preliminary integration eliminates the need for subsequent alignment mark creation steps, allowing faster fabrication while ensuring proper layer alignment from the start.

Inventive Principle:
Principle #10Preliminary action

3Reliability

If a protective layer is added to prevent oxidation, then reliability is improved, but device complexity increases

Engineering Contradiction:
Improveoxidation resistanceVSAvoidlayer structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The protective function is integrated into the existing insulating layer structure rather than adding a separate protective layer. The insulating layer serves both its primary function of electrical insulation and the additional function of protecting conductive layers from oxidation. This merging maintains reliability through oxidation protection while avoiding increased device complexity from additional layers.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The insulating layer is designed to perform multiple functions: providing electrical insulation between conductive layers and simultaneously serving as a protective barrier against oxidation. This multi-functionality improves reliability without increasing device complexity, as the same layer structure accomplishes both protection and insulation tasks.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Ease of manufacture

If conventional light sources are used, then ease of manufacture is maintained, but lifespan and environmental compatibility worsen

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidlifespan
Core Design Contradiction:
Ease of manufactureVSDuration of action of moving object

Solution Approach 1:

The patent replaces conventional mechanical/electrical light sources (incandescent bulbs, fluorescent lamps) with a solid-state light emitting element. This substitution enables significantly extended lifespan and improved environmental compatibility while maintaining ease of manufacture through standardized semiconductor fabrication processes and simple assembly procedures.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention transitions from traditional light source technologies to LED technology, representing a fundamental parameter change in the operating principles and material composition. This parameter change achieves extended lifespan and environmental benefits while the modular design and standardized fabrication processes maintain ease of manufacture.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces manufacturing efforts and costs, enhances product yield, and improves heat dissipation efficiency, preventing malfunction and light loss, while maintaining the environmental benefits of LED technology.

Implementation Method 1

a heat sink supporting the light source on a top surface thereof, the heat sink absorbing heat from the light source and dissipating the heat to the outside

Methodology Applied
Scientific EffectHeat dissipation: Heat Sink

Implementation Method 2

an insulating layer provided on at least one surface of the heat sink, the insulating layer having electrical insulating properties

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Implementation Method 3

a protective layer is stacked in the connection region... the protective layer protects the conductive layer from the bonding layer

Methodology Applied
Scientific EffectOxidation prevention: Oxidation

Data Source

PatentEP3116039B1Light source module, fabrication method therefor, and lighting device including the same
Publication Date: 2019.10.16 LG ELECTRONICS INC
  • EP3116039B1 patent drawingFigure 1~2
  • EP3116039B1 patent drawingFigure 3~4
  • EP3116039B1 patent drawingFigure 5~6

AI summary

A light source module includes at least one light source (11), and a body supporting the light source. The body includes a heat sink (120) supporting the light source (11) on a top surface thereof, the heat sink (120) absorbing heat from the light source (11) and dissipating the heat to the outside, an insulating layer (20) provided on at least one surface of the heat sink (120), the insulating layer (20) having electrical insulating properties, and a conductive layer (40) provided on the insulating layer (20). The conductive layer (20) includes connection regions through which electric current is supplied to the light source, and a light source region disposed between the connection regions, the light source region having the light source (11) mounted therein. A protective layer (60) is stacked in the connection region. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, protection of a conductive material, improvement of the lifespan of products, and enhancement of the stability of products. Furthermore, it is possible to obtain various effects that can be understood through configurations described in embodiments.