Vehicle LED Light Source Unit with Integrated Radiating Member

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Solution Overview

Problem

Existing semiconductor-type light source units for vehicle lighting devices are large in size and lack effective heat radiation mechanisms for LEDs, resistors, diodes, and conductors, leading to inefficient heat dissipation.

Innovation Solution

The design incorporates a base plate with a light emitting chip, a control device, and a wiring device attached to it, along with a socket featuring an insulating member, a radiating member for heat dissipation, and a feed member for power supply, where the radiating member is thermally conductive and integrated with the insulating member to enhance heat transfer and radiation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If LED, resistor, diode and conductor are mechanically and electrically connected with upper and lower contact portions and assembled to socket casing, then electrical connectivity is achieved, but the light source unit becomes large in size

Engineering Contradiction:
Improveelectrical connectivityVSAvoidsize of light source unit
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The base plate integrates multiple functions: it serves as the mounting substrate for light-emitting elements, provides thermal conduction path to the radiating member, and establishes electrical connections through integrated contact portions. This merging of structural, thermal, and electrical functions into a single base plate component reduces the overall number of parts and compact the light source unit size while maintaining reliable electrical connectivity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The base plate is designed as a multi-functional component that simultaneously performs mechanical support, thermal conduction, and electrical connection functions. The upper and lower contact portions are integrated into the base plate structure, allowing it to serve as both a structural element and an electrical conductor, thereby reducing the need for separate components and minimizing the light source unit size.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Device complexity

If LED, resistor, diode and conductor are assembled without heat radiation device, then device complexity is reduced, but heat radiation efficiency deteriorates

Engineering Contradiction:
Improvestructure complexityVSAvoidheat radiation efficiency
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The radiating member is integrated with the base plate through direct thermal contact, merging the heat dissipation function into the existing structural component. The base plate acts as a thermal bridge, conducting heat from the light-emitting elements to the radiating member, which then dissipates heat to the surrounding environment. This integration eliminates the need for separate heat sink components while improving heat radiation efficiency.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The base plate serves as a thermal intermediary between the light-emitting elements (LED, resistor, diode) and the radiating member. It conducts heat away from the heat-generating components and transfers it to the radiating member, which has a larger surface area for efficient heat dissipation. This intermediary thermal path improves heat radiation efficiency without adding complex separate cooling systems.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Temperature

If base plate and radiating member are in abutment for heat transfer, then heat radiation is improved, but electrical insulation may be compromised

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoidelectrical insulation
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

A thermally conductive adhesive layer is introduced as an intermediary between the base plate and the radiating member. This adhesive layer provides a dual function: it maintains efficient thermal conduction path for heat transfer while simultaneously providing electrical insulation between the conductive base plate and the radiating member. This resolves the conflict between heat transfer efficiency and electrical insulation requirements.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The adhesive layer's material properties are selected to have high thermal conductivity for efficient heat transfer but sufficient electrical resistivity for insulation. By changing the material parameters of the adhesive (choosing a thermally conductive but electrically insulating material), the system achieves both improved heat radiation and maintained electrical insulation reliability.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces the size of the light source unit, improves heat radiation efficiency, and allows for removable attachment to vehicle lighting devices, enhancing both heat dissipation and waterproofness while maintaining electrical connectivity.

Implementation Method 1

a radiating member which makes heat generated in the light source radiate outward

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the base plate and the radiating member are made to adhere to each other by a thermally conductive adhesive

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP2345836B1A light source unit for a semiconductor-type light source of vehicle lighting device and a vehicle lighting device
Publication Date: 2013.10.09 ICHIKOH IND LTD
  • EP2345836B1 patent drawingFigure 1
  • EP2345836B1 patent drawingFigure 2~3
  • EP2345836B1 patent drawingFigure 4~5

AI summary

The present invention includes a light source 10 and a socket 11. The light source 10 includes a base plate 3, light emitting chips 41 to 44 for a semiconductor-type light source, resistors 51, 52, diodes 53, 54 and wiring 6. The socket 11 includes an insulating member 7, a radiating member 8 and feed members 91 to 93. The light source 10 is attached to the socket 11. The base plate 3 is attached to the radiating member 8. Such a structure of the present invention can be implemented in reduced size and with an enhanced heat radiation effect.