LED Illumination Device Thermal Management via Conductive Substrate
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Solution Overview
Problem
LED lights in G9-compatible sockets face inefficiencies due to heat dissipation challenges and the need for onboard AC-to-DC converters, which increase costs and reduce light output when trying to replace incandescent bulbs.
Innovation Solution
An LED illumination device with a thermally-conductive body and substrate, featuring a planar heat transfer surface and fasteners, couples the LED array to a heat sink, eliminating the need for onboard converters by using a remote AC-to-DC converter and enhancing heat dissipation through a conductive pathway.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If LED bulbs are used to replace incandescent bulbs, then energy efficiency is improved, but heat dissipation becomes a critical challenge that degrades LED efficiency
Solution Approach 1:
The patent introduces a thermally conductive substrate as an intermediary between the LED array and the heat sink. This substrate serves as a mediator that efficiently transfers heat from the LEDs to the heat sink, resolving the heat dissipation challenge while maintaining the energy efficiency benefits of LED technology
Solution Approach 2:
The patent extracts the heat generation function from the LED assembly by implementing a separate heat sink system connected through a thermally conductive substrate. This separation allows the LEDs to focus on light generation while the dedicated heat dissipation system handles thermal management
2Adaptability or versatility
If G9-compatible LED lamps are created with onboard AC-to-DC converters, then compatibility with conventional sockets is improved, but device complexity and cost increase
Solution Approach 1:
The patent removes the AC-to-DC converter circuit from the LED lamp assembly and relocates it to the external power supply or mains wiring. This extraction eliminates the complexity and cost of onboard converters while maintaining G9 socket compatibility through the electrical connection structure
Solution Approach 2:
The patent leverages the existing electrical infrastructure (mains power and socket wiring) to provide the necessary AC-to-DC conversion functionality. The system uses the built-in capabilities of the external power supply rather than requiring self-contained conversion circuitry in the LED lamp
3Illumination intensity
If too many low-power LED chips are used in the array, then light output is improved, but power consumption increases offsetting the savings
Solution Approach 1:
The patent changes the power parameter of the LED chips from low-power to high-power variants. By using fewer high-power LEDs instead of many low-power LEDs, the system achieves the same or better light output with reduced total power consumption, eliminating the need for complex current management circuits
4Use of energy by moving object
If too few low-power LED chips are used in the array, then power consumption is reduced, but light output becomes insufficient to replace incandescent bulbs
Solution Approach 1:
The patent changes the power parameter of the LED chips from low-power to high-power variants. This parameter change allows achieving high illumination intensity with fewer LEDs, thereby reducing total power consumption while maintaining sufficient light output to replace incandescent bulbs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces heat-related inefficiencies and costs by effectively dissipating heat and providing efficient light output without the need for onboard converters, making LED lights more viable replacements for incandescent bulbs.
Implementation Method 1
A thermally-conductive body formed of aluminum or other suitable thermally-conductive material and including a substantially-planar heat transfer surface
Implementation Method 2
A substrate formed, at least in part from a dielectric material, supports an array of light emitting diodes
Data Source
AI summary
Provided are an illumination device and a light fixture including the illumination device. The illumination device includes a body formed of a thermally-conductive material that includes a planar heat transfer surface and a fastener that is compatible with a base that couples the body to the light fixture. A substrate formed, at least in part from a dielectric material supports an array of light emitting diodes and a plurality of contacts electrically connected to the light emitting diodes. A thermally-conductive planar surface is provided to the dielectric material of the substrate to be placed in thermal communication with the heat transfer surface and conduct heat generated by the light emitting diodes to the body.