Light-transmissive member cutting for LED lateral surface coverage

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Solution Overview

Problem

Existing methods for manufacturing light-emitting devices require large cutting widths of fluorescent material sheets to ensure adequate coverage by reflective resin units, leading to increased cutting quantities and potential thickness issues of light-transmissive members.

Innovation Solution

A method involving flip-chip mounting of light-emitting elements, bonding light-transmissive members with light-guiding members, and subsequent scraping and covering with a reflective layer to manage lateral surface gaps and ensure sufficient thickness without extensive cutting, reducing the cutting quantity of light-transmissive members.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If fluorescent material sheets are layered on optical element sheets and cut together to ensure reflective resin units cover lateral surfaces, then the covering thickness is sufficient, but the cutting width of fluorescent material sheets must be large increasing cutting quantity

Engineering Contradiction:
Improvecovering thicknessVSAvoidcutting quantity
Core Design Contradiction:
Manufacturing precisionVSQuantity of substance

Solution Approach 1:

The patent applies preliminary action by pre-forming the light-transmissive member with a specific width before mounting, and pre-positioning the reflective resin unit in the groove. This allows the light-transmissive member to be cut to a smaller width while ensuring the reflective resin unit is already in place to cover the lateral surface, thereby reducing the cutting quantity without compromising covering thickness.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent segments the manufacturing process into distinct steps: forming the light-transmissive member, creating a groove, positioning the reflective resin unit, and then cutting. This segmentation allows the light-transmissive member to be optimized for minimal cutting width while the reflective resin unit independently provides the necessary lateral surface coverage.

Inventive Principle:
Principle #1Segmentation

2Productivity

If the cutting width of light-transmissive member is reduced to decrease cutting quantity, then manufacturing efficiency improves, but the thickness of covering member may become insufficient

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidcovering thickness
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The groove acts as an intermediary structure that holds the reflective resin unit in position. By forming a groove in the light-transmissive member and placing the reflective resin unit within it, the patent ensures that even when the light-transmissive member has a reduced cutting width, the reflective resin unit maintains sufficient coverage of the lateral surface through its positioned placement in the groove.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Quantity of substance

If light-transmissive member width is narrowed after mounting, then cutting quantity is reduced, but lateral surface coverage must be maintained

Engineering Contradiction:
Improvecutting quantityVSAvoidlateral surface coverage
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The reflective resin unit is preliminarily positioned in the groove before the light-transmissive member is cut to its final narrowed width. This preliminary positioning ensures that when the width is reduced, the reflective resin unit is already in place to maintain reliable lateral surface coverage of the LED element.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach minimizes the cutting quantity of light-transmissive members while ensuring a sufficient thickness of the covering layer, enhancing light extraction efficiency and reducing lateral light leakage, thereby improving the manufacturing efficiency and performance of light-emitting devices.

Implementation Method 1

applying a light-guiding member to a light-emitting element

Methodology Applied
Scientific EffectLight guiding: Waveguide (optics)

Implementation Method 2

Lateral surfaces of the light-transmissive member and lateral surfaces of the light-guiding member are covered

Methodology Applied
Scientific EffectLight transmission: Refraction

Implementation Method 3

reflective resin units covering the lateral surfaces of the optical elements and the fluorescent material layers

Methodology Applied
Scientific EffectLight reflection: Reflection

Data Source

PatentUS10825968B2Method for manufacturing light-emitting device
Publication Date: 2020.11.03 NICHIA CORP
  • US10825968B2 patent drawing
  • US10825968B2 patent drawing
  • US10825968B2 patent drawing

AI summary

A method of manufacturing a light-emitting device includes applying a light-guiding member to a light-emitting element. A light-transmissive member is mounted on the light-guiding member, and the light-guiding member is cured. A width of the light-transmissive member is narrowed. Lateral surfaces of the light-transmissive member and lateral surfaces of the light-guiding member are covered.