LED Lighting Apparatus with Roughened Aluminum Substrate for Wiring Adhesion
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Solution Overview
Problem
The existing LED lighting apparatuses face issues with delamination of wiring substrates due to insufficient adhesion on specular aluminum surfaces and thermal expansion, leading to reliability concerns.
Innovation Solution
The LED lighting apparatus features a roughened surface region outside the reflectivity-enhanced layers for bonding the printed wiring substrate, along with a multilayer structure including an adhesive, reflective, and enhanced reflectivity layers, ensuring strong adhesion and thermal stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If specular treatment (vapor deposition or anodizing) is applied to the aluminum substrate to enhance light reflection, then the light reflection efficiency is improved, but the adhesion between layers becomes insufficient causing delamination
Solution Approach 1:
The patent segments the aluminum substrate surface into two distinct regions: a specular-treated region for light reflection and a roughened region for bonding. This spatial segmentation allows each region to optimize its function without compromising the other, resolving the contradiction between reflection efficiency and adhesion strength.
Solution Approach 2:
The patent applies different surface treatments to different locations on the aluminum substrate. The specular treatment is applied locally to the region where light reflection is needed, while a roughened surface is created locally at the bonding region. This local differentiation of surface properties resolves the contradiction by providing high reflection efficiency where needed while ensuring strong adhesion at the bonding interface.
2Adaptability or versatility
If the aluminum substrate is subjected to thermal expansion and thermal shrinkage due to temperature changes, then the adaptability to temperature variations is improved, but interlayer delamination occurs
Solution Approach 1:
The patent performs preliminary roughening of the bonding surface before bonding the wiring substrate. This preliminary surface preparation creates a roughened region that provides mechanical interlocking capability in advance, preventing delamination that would otherwise occur during thermal expansion and shrinkage cycles.
Solution Approach 2:
The patent creates a composite surface structure on the aluminum substrate, combining the specular-treated aluminum layer with a roughened surface layer at the bonding region. This composite structure provides both the thermal adaptability of aluminum and the enhanced mechanical bonding capability of the roughened surface, preventing delamination during temperature variations.
3Ease of manufacture
If the wiring substrate is bonded directly to the specular surface by adhesive sheet, then the manufacturing process is simplified, but delamination of the wiring substrate occurs
Solution Approach 1:
The patent applies a local roughening treatment only at the bonding region where the wiring substrate will be attached. This localized modification maintains the simplicity of the overall manufacturing process while dramatically improving bonding strength at the critical interface, preventing delamination without complicating the manufacturing workflow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents delamination and enhances the bonding strength between the aluminum substrate and the printed wiring substrate, resulting in a high-reliability LED lighting apparatus.
Implementation Method 1
the adhesion between the layers formed by the specular treatment is insufficient
Implementation Method 2
forming a roughened surface region on the aluminum substrate by removing the plurality of reflectivity-enhanced layers
Implementation Method 3
apply specular treatment such as vapor deposition or anodizing treatment to an aluminum surface and then mount an LED device thereon so that the light emitted from the LED device can be reflected efficiently
Implementation Method 4
a plurality of reflectivity-enhanced layers formed on the aluminum substrate, an LED device bonded on the plurality of reflectivity-enhanced layers, a printed wiring substrate bonded onto a region on the aluminum substrate
Data Source
AI summary
To provide an LED lighting apparatus and a method for manufacturing the same that can improve the bonding strength between an aluminum substrate and a printed wiring substrate. An LED lighting apparatus and a method for manufacturing the same, the LED lighting apparatus includes an aluminum substrate, a plurality of reflectivity-enhanced layers formed on the aluminum substrate, an LED device bonded on said plurality of reflectivity-enhanced layers, a printed wiring substrate bonded onto a region on the aluminum substrate other than a region where the plurality of reflectivity-enhanced layers are formed, a wire for connecting between the printed wiring substrate and the LED device, a frame member formed so as to surround said LED device, and a phosphor resin deposited over a region inside the frame member.