LED Lighting Device Convection Cooling Structure
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Solution Overview
Problem
Existing lighting devices with high luminosity density, particularly those using LEDs, face challenges in efficient heat dissipation due to the rapid decline in electro-optical conversion efficiency with increasing temperature, especially in confined environments.
Innovation Solution
A lighting device design featuring a thermally conductive housing with spaced-apart protrusions and a peripheral housing that promotes convection cooling, where LEDs are mounted on protrusions for direct heat transfer to the housing, and additional heat dissipation members can be integrated to enhance cooling capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a plurality of light emitting sources is assembled in a housing to increase luminosity density, then illumination intensity is improved, but temperature increases causing electro-optical conversion efficiency to drop
Solution Approach 1:
The patent introduces a three-dimensional heat dissipation structure with vertical fins extending from the circuit board, transforming the traditional two-dimensional heat dissipation surface into a multi-dimensional structure that occupies vertical space within the housing, thereby increasing heat dissipation area without expanding the horizontal footprint
Solution Approach 2:
The patent introduces an intermediate heat dissipation structure (fins) positioned between the light emitting sources on the circuit board and the housing walls, serving as a thermal mediator that facilitates heat transfer from the sources to the housing through conduction, convection, and radiation
2Illumination intensity
If the density of light-emitting sources increases, then luminosity density is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent utilizes the vertical dimension by extending heat dissipation fins upward from the circuit board, creating additional heat dissipation surfaces in the vertical direction that do not interfere with the horizontal arrangement of light emitting sources, thereby maintaining high source density while improving heat dissipation
Solution Approach 2:
The patent segments the heat dissipation function into multiple independent fin structures distributed across the circuit board, allowing heat to be dissipated through multiple parallel pathways rather than relying on a single heat sink, thereby improving overall heat dissipation efficiency
3Volume of moving object
If a confined environment is used for lighting device, then device compactness is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent exploits the vertical space within the confined housing by extending heat dissipation fins upward, utilizing the z-dimension for heat dissipation while maintaining a compact horizontal footprint, thereby achieving effective heat dissipation in a limited volume
Solution Approach 2:
The patent applies heat dissipation fins selectively in regions where space is available within the housing, concentrating heat dissipation structures in specific local areas rather than uniformly distributing them, thereby optimizing heat dissipation within the confined volume
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively maintains the temperature of LEDs within acceptable limits, optimizing their operation by increasing the heat dissipation area and utilizing convection cooling to prevent thermal degradation, thereby enhancing the overall efficiency and longevity of the lighting device.
Implementation Method 1
an intermediate heat dissipation structure which is disposed intermediate said circuit board and said base portion of said housing, for promoting cooling by convection
Implementation Method 2
a plurality of light emitting sources mounted on a thermally conductive housing
Data Source
AI summary
A lighting device contains a plurality of light emitting sources mounted on a thermally conductive housing and electrically connected to a circuit board. The housing includes a base portion which is spaced apart from the circuit board, and an intermediate heat dissipation structure which is disposed between the circuit board and the base portion of the housing, for promoting cooling by convection. The plurality of light emitting sources are in thermal communication with the intermediate heat dissipation structure.