LED Lighting Device Heat Dissipation Structure
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Solution Overview
Problem
Lighting devices, particularly those with solid state light emitters, face challenges in heat dissipation, leading to reduced lifespan and variability in light intensity and color due to temperature changes, necessitating efficient thermal management solutions to maintain optimal operating conditions.
Innovation Solution
The implementation of a lighting device design featuring a heat transfer element and a plurality of heat dissipation elements with specific thermal coupling configurations, allowing for effective heat transfer by conduction and convection, minimizing thermal resistance, and optimizing space usage while maintaining a compact form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If solid state light emitters are used to improve energy efficiency, then energy efficiency is improved, but heat dissipation becomes more critical due to elevated operating temperatures
Solution Approach 1:
The heat dissipation structure extends in multiple spatial dimensions with fins projecting outward from a central heat transfer element, creating a three-dimensional thermal management system that efficiently dissipates heat from the LED junction through extended surface area in radial and axial directions
2Temperature
If heat dissipation structures are added to manage thermal resistance, then temperature control is improved, but device complexity increases
Solution Approach 1:
The heat transfer element and heat dissipation structure are integrated into a single unified component where the heat transfer element serves as the core and the fins are directly formed as extensions, eliminating the need for separate heat sink components and simplifying assembly while maintaining effective thermal management
3Temperature
If multiple heat dissipation elements are provided to improve heat transfer, then heat dissipation efficiency is improved, but material usage increases
Solution Approach 1:
The heat dissipation structure is divided into multiple discrete fin elements that are distributed around the heat transfer element, allowing heat to be dissipated through multiple parallel thermal pathways simultaneously, which increases effective heat transfer surface area while using material efficiently through the segmented radial arrangement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the thermal management of lighting devices, extending the lifespan of solid state light emitters, stabilizing light output, and reducing material usage, while allowing for a more aesthetically pleasing and easily installable design with improved heat dissipation efficiency.
Implementation Method 1
heat transfer by conduction
Implementation Method 2
heat transfer by convection
Data Source
AI summary
A lighting device comprising at least a first light emitter, at least a first heat transfer element, and a plurality of heat dissipation elements. Each heat dissipation element has at least a first region and a second region, the first region being in contact with the first heat transfer element, the second region being closer to the first light emitter than the first region. The first light emitter is thermally coupled to the first heat transfer element.