Compact LED Lighting Device with Integrated Heat Sink Carrier
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Solution Overview
Problem
Existing LED retrofit lamps require significant space for insulation and safety distances due to the complex positioning of semiconductor light sources, limiting their compactness and efficiency.
Innovation Solution
A compact LED lighting device design featuring a heat sink with an integrated carrier and electrically insulating lead, using a non-SELV driver without a transformer, which reduces the need for large insulation distances and allows for a more compact form factor while maintaining safety through effective creepage paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a carrier with screw positioning is used to mount semiconductor light sources, then the light sources can be securely positioned, but the device occupies a large amount of space due to insulation requirements
Solution Approach 1:
The patent merges the carrier and heat sink into a single integrated component. The carrier is formed as an integral part of the heat sink body, eliminating the need for separate mounting structures and reducing overall device volume while maintaining secure positioning of semiconductor light sources through the integrated carrier geometry
Solution Approach 2:
The patent utilizes the depth dimension of the heat sink by forming recesses and protrusions that create insulation paths in the vertical direction. The bearing surface with projection extends into the heat sink body, creating creepage distances through the thickness dimension rather than requiring lateral spacing, thus reducing the device's footprint area
2Reliability
If insulation distances of at least 5 mm are maintained between potential-carrying surface areas and heat sink, then electrical safety is ensured, but the device requires a large amount of space
Solution Approach 1:
The patent transitions insulation from a lateral planar arrangement to a vertical three-dimensional configuration. The bearing surface projection extends into the heat sink body, creating insulation paths that utilize the depth dimension. This allows the creepage distance to be achieved through vertical spacing rather than lateral distance, significantly reducing the device's footprint area while maintaining the required 5 mm insulation distance
Solution Approach 2:
The patent introduces an electrically insulating material filling the space between the bearing surface projection and the heat sink cavity wall. This intermediary insulating material ensures the required creepage distance is maintained while allowing more compact positioning of components, thereby reducing the overall device footprint without compromising electrical safety
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a more compact and efficient LED retrofit lamp with enhanced thermal conductivity and electrical insulation, achieving higher efficiency and cost-effectiveness while ensuring safety from overvoltage pulses.
Implementation Method 1
The heat sink can advantageously consist of a material with good thermal conductivity with λ>10 W/(m·K), particularly preferably λ>100 W/(m·K), in particular of a metal such as aluminum, copper or an alloy thereof
Implementation Method 2
at least one electrically insulating lead connecting the recess to the outside of the heat sink
Data Source
Figure 1~2
Figure 3
Figure 4
AI summary
The invention relates to a lighting device (1) comprising a heat sink (4), which has at least one carrier (6) attached to the outside (5) of the heat sink for at least one semiconductor light source (7), in particular a light-emitting diode, and a cavity (14) for accommodating a driver (20) and at least one electrically insulating supply (8), which connects the cavity (14) to the outside (5) of the heat sink (4), wherein the supply (8) comprises a contact surface (24) that connects to the outside (5) of the heat sink (4) in a flush manner, wherein the contact surface is at least partially covered by the carrier (6).