LED Lighting Module with Perpendicular Circuit Board

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Solution Overview

Problem

Conventional LED-based illuminant devices suffer from directional light emission, making them less competitive with halogen bulbs in terms of non-directionality, and the soldering process during assembly is complex and prone to errors, leading to potential disconnection and reduced illumination.

Innovation Solution

The design incorporates a main circuit board with through holes and grooves, featuring transparent substrates with LED dies and a resin layer, and a driving unit with protrusions, allowing for improved electrical connections and a wider illuminant angle by arranging lighting units at a predetermined angle, such as 90 degrees, and using connecting members to enhance stability and assembly ease.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Shape

If LEDs are arranged on a planar circuit board surface, then the device structure is simple, but the light emission is directional and the illuminant area is limited

Engineering Contradiction:
Improvecircuit board surfaceVSAvoidilluminant area
Core Design Contradiction:
ShapeVSIllumination intensity

Solution Approach 1:

The patent transitions from a 2D planar arrangement to a 3D vertical arrangement by standing the circuit board perpendicular to the housing bottom surface. This dimensional change allows light to emit in multiple directions (upward, downward, sideways) rather than just in one direction, significantly expanding the illuminant area while maintaining structural simplicity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If connecting lines are used to electrically connect lighting module and driving module, then electrical connection is achieved, but the soldering process becomes complex and connections are prone to disconnection

Engineering Contradiction:
Improveelectrical connectionVSAvoidassembly process
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the driving circuit directly onto the same circuit board as the lighting components, eliminating the need for separate connecting lines between distinct modules. This integration removes the soldering process entirely, simplifying assembly and eliminating connection failure risks while maintaining reliable electrical connections.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts and eliminates the vulnerable connecting lines and soldering joints from the system by integrating all electrical connections onto a single circuit board. This removal of the problematic intermediate connection layer simplifies the overall structure and improves reliability.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the uniformity and non-directionality of light emission, similar to halogen bulbs, while simplifying the assembly process and increasing the reliability of connections, thus providing a more robust and effective LED lighting solution.

Implementation Method 1

A light emitting diode (LED) is a kind of semiconductor device, which exploits the property of direct-bandgap semiconductor material to convert electric energy into light energy efficiently

Methodology Applied
Scientific EffectLight emitting diode (LED): Light Emitting Diode

Data Source

PatentUS9307589B2Illuminant device and lighting module thereof
Publication Date: 2016.04.05 LEDIAMOND OPTO
  • US9307589B2 patent drawing
  • US9307589B2 patent drawing
  • US9307589B2 patent drawing

AI summary

A lighting module includes a main circuit board, a plurality of lighting units, and a driving unit. The main circuit board forms a plurality of through holes. Each lighting unit includes a transparent substrate, a circuit layer, a plurality of light emitting diode (LED) dies, and a transparent resin layer. The transparent substrates are arranged on the main circuit board, and then a predetermined angle spans between a first surface of each transparent substrate and the main circuit board. The circuit layer and the LED dies are placed on the first surface, and the LED dies are electrically connected to the circuit layer. The transparent resin layer covers the LED dies. The driving unit includes a driving circuit board including a plurality of protrusions. The protrusions are respectively inserted into the through holes such that the driving circuit board is substantially perpendicular to the main board.