LED Assembly Linear Light Source for Narrow Bezel LCD
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Solution Overview
Problem
The existing liquid crystal display (LCD) devices face challenges in achieving a large display area with a narrow bezel and slim thickness due to the light mixing length required for uniform light emission from LEDs, which limits bezel width and thickness.
Innovation Solution
An LED assembly with a supporting layer, LED chips spaced apart, a coating layer containing a fluorescent substance to convert point light sources into a linear light source, and an electrode pattern layer for efficient light distribution, reducing the need for electrode leads and allowing for increased LED density and uniform light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If LEDs are mounted on a printed circuit board with predetermined spacing, then the LED assembly provides sufficient light mixing length for uniform light emission, but the bezel width and device thickness increase
Solution Approach 1:
The patent transitions from mounting LEDs on a planar printed circuit board to directly mounting LED chips on the light guide plate surface. This dimensional change allows LEDs to be positioned at the edge of the display area, converting the light mixing approach from requiring lateral spacing to utilizing the light guide plate's optical properties for uniform distribution, thereby minimizing bezel width while maintaining uniform light emission.
Solution Approach 2:
The patent extracts the LED mounting function from the printed circuit board and integrates it directly onto the light guide plate. This separation eliminates the need for a dedicated PCB structure with spaced LED mounts, allowing the lighting function to be combined with the optical guiding function in a single integrated component, thus reducing overall device thickness and bezel requirements.
2Reliability
If LEDs are mounted on a printed circuit board with electrode leads and solder connections, then the LED assembly provides reliable electrical connection, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the LED chip mounting and electrical connection functions into a single integrated structure on the light guide plate. By eliminating the separate printed circuit board and its associated electrode leads and solder joints, the design reduces the number of assembly steps and potential failure points while maintaining reliable electrical connections through direct bonding of LED chips to the light guide plate's conductive structures.
Solution Approach 2:
The light guide plate itself serves dual functions: as the optical element that guides and distributes light, and as the mounting substrate that provides both mechanical support and electrical connection pathways for the LED chips. This self-service approach eliminates the need for separate dedicated components for each function, simplifying manufacturing while ensuring reliable electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes light mixing length, increases light efficiency, decreases bezel width, and reduces the overall thickness of the LCD device, while also simplifying manufacturing and reducing costs by eliminating the need for soldering and wire connections.
Implementation Method 1
a coating layer formed over the LED chips and including a fluorescent substance, wherein the coating layer changes light emitted from the LED chips into a linear light source
Data Source
AI summary
An LED assembly includes a supporting layer; LED chips arranged on a first surface of the supporting layer and spaced apart from each other; a coating layer formed over the LED chips and including a fluorescent substance, wherein the coating layer changes light emitted from the LED chips into a linear light source; and an electrode pattern layer formed on a second surface of the supporting layer and in selectively removed regions of the supporting layer and contacting the LED chips.


