Light Emitting Device Luminescence Layer Integration
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Solution Overview
Problem
Nitride light-emitting devices face issues with non-uniform phosphor application and heat vulnerability in the packaging process, leading to inefficiencies in producing white light emission.
Innovation Solution
A light-emitting device design that integrates a luminescence layer with a phosphor within the device, eliminating the need for additional phosphor in the package and improving thermal stability through a reflective layer and conductive support member, allowing for direct and indirect light emission to produce white light.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If phosphor is applied onto the light-emitting chip in the package fabrication process, then white light can be produced, but the phosphor application becomes non-uniform and vulnerable to heat
Solution Approach 1:
The phosphor layer is formed on the light-emitting chip before packaging, allowing uniform phosphor distribution to be achieved during the chip fabrication process rather than during subsequent packaging. This preliminary action ensures consistent phosphor application and positioning, eliminating the non-uniformity problem that occurs when phosphor is applied later in the packaging process.
Solution Approach 2:
The phosphor layer formation is merged with the light-emitting chip fabrication process. By integrating phosphor deposition into the chip manufacturing sequence (forming phosphor layer 140 on the light-emitting chip 170), the process achieves both chip fabrication and phosphor application in one unified process flow, ensuring uniformity and reducing thermal exposure during separate packaging steps.
2Ease of manufacture
If phosphor is applied in the form of a mixture with transparent silicone, then phosphor can be positioned, but it becomes vulnerable to heat generated by the light-emitting chip
Solution Approach 1:
The phosphor is extracted from the transparent silicone mixture approach and applied as a distinct phosphor layer 140 formed directly on the light-emitting chip 170. This separation eliminates the need for phosphor to be mixed with silicone, thereby removing the thermal vulnerability associated with the silicone-phosphor composite while maintaining ease of positioning through direct layer formation.
3Reliability
If a luminescence layer is integrated within the light-emitting device, then thermal stability is improved, but the device structure becomes more complex
Solution Approach 1:
The luminescence layer 140 containing phosphor is merged with the light-emitting chip 170 structure, forming an integrated unit where the phosphor layer is deposited directly on the chip surface. This integration achieves thermal stability by eliminating separate phosphor packaging steps while maintaining relatively simple device architecture through the unified chip-luminescence structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances light emission efficiency, reduces phosphor-related packaging issues, and improves thermal stability, resulting in a more reliable and efficient white light output with adjustable color temperature.
Implementation Method 1
a reflective layer (130) arranged on the support member (110), a luminescence layer (140) arranged on the reflective layer (130)
Implementation Method 2
a luminescence layer (140) arranged on the reflective layer (130)... allowing for direct and indirect light emission to produce white light
Data Source
Figure 1~2
Figure 3~4
Figure 5a~5b
AI summary
Disclosed is a light-emitting device (10) comprising a reflective layer (2); a light-emitting structure (4) on the reflective layer, the light-emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer and a luminescence layer (3) interposed between the reflective layer and the light-transmitting electrode layer. Accordingly, the luminescence layer is formed in the chip formation process to minimize non-uniform application of a phosphor composed of an epoxy resin and simplify fabrication of the light-emitting device.