LED Matrix Mounting With Copper Hybrid Bonding for Heat Dissipation
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Solution Overview
Problem
High pixel density in monolithic LED matrix components for motor vehicle light modules leads to complex electrical connections and increased bulk, which complicates heat dissipation and assembly processes, particularly as the distance between light sources decreases.
Innovation Solution
A process involving the formation of electrically conductive copper tracks on both the substrate and carrier, allowing direct contact and annealing to create a hybrid-bonding connection without the need for filler materials, providing mechanical, electrical, and thermal conductivity while simplifying the assembly process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If high pixel density is achieved by decreasing the distance between elementary light sources, then the luminous resolution and performance are improved, but the bulk on the back surface increases and heat dissipation becomes more difficult
Solution Approach 1:
The patent merges the electrical connection function and heat dissipation function into a single integrated copper track structure. The copper tracks serve dual purposes: providing electrical connectivity to individual LEDs and acting as heat sinks to conduct away thermal energy from the high-density LED array, thereby resolving the contradiction between achieving high pixel density and managing the resulting bulk and heat dissipation challenges.
Solution Approach 2:
The copper track network is designed to perform multiple functions simultaneously: electrical conduction to power individual LED pixels, thermal conduction to dissipate heat from the dense LED array, and mechanical support to hold the LED component in place on the carrier. This multi-functionality eliminates the need for separate filler materials and reduces overall assembly bulk.
2Manufacturing precision
If high pixel density is achieved by decreasing the distance between elementary light sources, then the luminous resolution is improved, but the assembly process becomes more complex
Solution Approach 1:
The patent combines multiple assembly steps into a simplified process: copper tracks are formed directly on the carrier substrate, the LED component is positioned and makes contact with the tracks, and annealing simultaneously creates both mechanical bonding and electrical connections. This eliminates the need for separate filler material application and reduces assembly complexity despite high pixel density requirements.
Solution Approach 2:
The patent extracts and eliminates the filler material step from the assembly process. By using direct copper track contact for both electrical connection and mechanical support, the complex multi-step process involving filler material application, curing, and alignment is replaced with a simpler annealing-based bonding process.
3Temperature
If filler material is used to dissipate heat from high-density LED arrays, then heat dissipation is improved, but the assembly process requires additional steps
Solution Approach 1:
The copper tracks are designed to serve as both electrical conductors and thermal management pathways. The same copper structures that provide electrical connectivity to individual LEDs also function as heat sinks, conducting thermal energy away from the high-density LED array. This eliminates the need for separate heat-conducting filler materials and reduces the number of assembly steps.
Solution Approach 2:
The patent removes the filler material component from the assembly process entirely. By integrating heat dissipation functionality into the copper track network, the separate step of applying heat-conducting resin or filler material is eliminated, simplifying the assembly process while maintaining effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the production of high pixel density LED matrices with improved heat exchange and reduced assembly complexity, maintaining resolution and performance without the use of heat-conducting resins, thus addressing the challenges of increased bulk and heat dissipation in high-density light source configurations.
Implementation Method 1
annealing the assembly composed of the carrier and of the light component at a temperature of between 200° C. and 400° C.
Data Source
AI summary
A process for mounting a light component on a carrier. The light component includes a generally planar substrate, on a first face of which submillimetre-sized electroluminescent semiconductor elements are epitaxied in the form of a matrix. The process is noteworthy in that it eliminates the need for a layer of filler material between the component and the carrier, while providing good thermal and electrical conductivity between the component and the carrier and high mechanical strength.