LED Package Metal Inlay Layout for Bottom-Side Heat Dissipation
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Solution Overview
Problem
Heat dissipation in LED arrays and silicon backplanes is challenging due to the compact size and proximity of these components, making it difficult to dissipate heat effectively through the top surface, which is often obstructed by light emission.
Innovation Solution
A hybridized device with a metal inlay thermally coupled to the bottom surface, allowing for heat dissipation through the bottom surface, and conductive connectors for electrical coupling, enabling the placement of passive components on the top surface and efficient heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation is attempted through the top surface of LED arrays and silicon backplanes, then heat removal is achieved, but light emission is obstructed
Solution Approach 1:
The patent inverts the conventional heat dissipation approach by moving the thermal management function from the top surface to the bottom surface of the packaging substrate. The metal inlay is positioned on the bottom surface to conduct heat away from the LED array and silicon backplane, allowing the top surface to remain clear for unobstructed light emission while maintaining effective thermal management through the inverted heat dissipation path
2Area of stationary object
If the packaging substrate is made compact to accommodate small addressable LED systems, then system size is reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The patent addresses the heat dissipation challenge in compact systems by transitioning from two-dimensional top-surface heat removal to three-dimensional thermal management utilizing the bottom surface dimension. The metal inlay extends across the bottom surface area, creating additional thermal conduction pathways that enable effective heat dissipation without increasing the top footprint or obstructing light emission
3Ease of manufacture
If conventional top-surface mounting is used for passive components, then electrical connectivity is achieved, but thermal management is hindered
Solution Approach 1:
The patent segments the functional zones of the packaging substrate by separating thermal management (bottom surface with metal inlay) from electrical connectivity (top surface with conductive contacts). This segmentation allows passive components to be mounted on the top surface for ease of manufacture and electrical connection, while the bottom surface independently handles thermal management without interference
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution facilitates effective heat dissipation and accommodates a large number of passive components, improving the thermal management of LED arrays and silicon backplanes without obstructing light emission.
Implementation Method 1
The metal inlay is thermally coupled to the bottom surface of the hybridized device
Data Source
AI summary
Light-emitting devices are described herein. A device includes a hybridized device having a top surface and a bottom surface and a packaging substrate comprising a metal inlay in an opening on a top surface of the packaging substrate. The metal inlay is thermally coupled to the bottom surface of the hybridized device. The device also includes conductive contacts on the top surface of the packaging substrate and conductive connectors electrically coupled between the top surface of the hybridized device and the top surface of the packaging substrate.