LED Packaging with Embedded Metal Inlay for Thermal Management
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Solution Overview
Problem
Precision control lighting applications require efficient manufacturing methods for small addressable LED systems, which face challenges in heat dissipation and component placement due to their compact size and complex thermal management needs.
Innovation Solution
The method involves a hybridized device with a silicon backplane and an LED array mounted on a packaging substrate with an embedded metal inlay for thermal coupling, allowing for effective heat dissipation through the bottom surface and enabling the placement of passive components close to the LED array, while wirebonding conductive connectors for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the LED system size is reduced for compact applications, then the device can be used in small-scale applications like vehicle headlamps, but heat dissipation becomes more difficult due to limited space
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat management by embedding the metal inlay within the packaging substrate. This allows heat to be conducted vertically through the substrate thickness rather than only laterally across the surface, effectively adding a thermal management dimension without increasing the device footprint.
Solution Approach 2:
The metal inlay acts as a thermal intermediary between the LED array and the packaging substrate. It provides a high-conductivity thermal pathway that mediates heat transfer from the heat-generating LED components through the substrate, enabling efficient heat dissipation in the compact structure.
2Area of stationary object
If passive components are placed close to the LED array to reduce size, then the overall device footprint is reduced, but thermal management becomes more challenging due to proximity to heat sources
Solution Approach 1:
The patent applies local quality by creating distinct thermal zones within the packaging substrate. The metal inlay establishes a high-thermal-conductivity pathway in specific regions, allowing passive components placed nearby to benefit from localized heat management without requiring the entire substrate to be optimized for thermal performance.
Solution Approach 2:
The packaging substrate is segmented into functional regions: the metal inlay region for primary heat dissipation, and surrounding areas for passive component placement. This segmentation allows different zones to serve different purposes - thermal management in the inlay region and electronic functionality in the surrounding regions - reducing thermal interference while maintaining compactness.
3Manufacturing precision
If unconventional manufacturing processes are used for small LED systems, then production can achieve required precision for compact devices, but manufacturing complexity increases
Solution Approach 1:
The patent merges multiple manufacturing operations into a unified process flow. The metal inlay is embedded during substrate fabrication, the LED array is mounted in a single attachment step, and wire bonding integrates electrical connections during the same assembly process. This consolidation reduces the number of separate manufacturing steps while achieving high precision for compact device requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach facilitates efficient heat dissipation and allows for a high-density placement of passive components, enhancing the thermal management and electrical connectivity of LED lighting systems, particularly in compact applications like vehicle headlamps.
Implementation Method 1
embedded metal inlay for thermal coupling, allowing for effective heat dissipation through the bottom surface
Implementation Method 2
wirebonding a top surface of the hybridized device to a top surface of the packaging substrate using a plurality of conductive connectors
Data Source
AI summary
Methods of manufacturing light-emitting devices are described herein. A method includes obtaining a packaging substrate comprising an embedded metal inlay and a plurality of first contacts on a top surface of the packaging substrate, forming a hybridized device, attaching a bottom surface of the hybridized device to a top surface of the metal inlay, and wirebonding a top surface of the hybridized device to a top surface of the packaging substrate using a plurality of conductive connectors.