Light Emitting Device Metal Patterns Bonding Member
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional light emitting devices suffer from low light reflectivity and high optical absorptance due to bonding members, leading to insufficient light extraction and reliability issues, especially when exposed to heat and light from the light emitting elements.
Innovation Solution
A light emitting device design featuring a support member with an insulating base and metal patterns on its surface and sides, where the bonding member covers the metal patterns, directing excess material away from the light emitting element to prevent light absorption and enhance light extraction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding members made of thermosetting resins or metals are used to mount the light emitting element, then reliable bonding is achieved, but light reflectivity decreases and optical absorptance increases
Solution Approach 1:
The bonding member is divided into two distinct parts: a first portion made of thermosetting resin for reliable bonding, and a second portion made of light-reflecting material for high light reflectivity. This segmentation allows each part to perform its specific function optimally without compromise.
Solution Approach 2:
Different regions of the bonding member have different material properties tailored to their specific functions. The first portion (bonding region) uses thermosetting resin for strong adhesion, while the second portion (light-exposed region) uses light-reflecting material for optimal light extraction.
2Strength
If a large amount of bonding member is applied to ensure reliable bonding, then bonding strength is improved, but light absorption increases due to material spreading to surrounding areas
Solution Approach 1:
The bonding member's material composition varies by location: the first portion contains thermosetting resin for bonding strength, while the second portion contains light-reflecting material to counteract light absorption, allowing the structure to handle both bonding and optical requirements simultaneously.
Solution Approach 2:
The bonding member is constructed as a composite structure with two different materials: thermosetting resin providing mechanical bonding and light-reflecting material providing optical performance. This composite approach resolves the contradiction between bonding strength and light extraction efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves light extraction efficiency and reduces positional deviations and tilting of the light emitting element, maintaining high reliability and performance by directing excess bonding material to non-critical areas and using materials with higher wettability to prevent light absorption.
Implementation Method 1
light is absorbed by the bonding member located near the light emitting element
Implementation Method 2
the light reflectivity of the metal materials typically used in the bonding member is lower than that of the materials typically used in a reflective member
Implementation Method 3
using materials with higher wettability to prevent light absorption
Data Source
AI summary
A light emitting device includes a substrate; a light emitting element mounted on an upper surface of the substrate; a light-reflecting member surrounding lateral surfaces of the light emitting element; and a sealing member disposed over an upper surface of the light emitting element and an upper surface of the light-reflecting member. An outer edge of the upper surface of the light-reflecting member coincides with an outer edge of a lower surface of the sealing member.