Multi-Wavelength LED Device with Metal Sintered Bonding
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Solution Overview
Problem
Existing light emitting devices that use LEDs emit monochromatic light, requiring multiple packages to produce various colors, which complicates manufacturing and increases volume, and current bonding methods for flip-chip LEDs suffer from heat dissipation and reliability issues.
Innovation Solution
A light emitting device with two separate units emitting different wavelengths, each with a wavelength converter and a sidewall, using metal sintered bonding layers for improved heat dissipation and reliability, and a substrate with exposed electrodes for independent operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple light emitting diode packages are mounted to emit different colors, then various colors can be emitted, but device complexity and volume increase
Solution Approach 1:
The patent divides the light emitting device into multiple independent light emitting units (first light emitting unit, second light emitting unit, etc.) that are spatially separated and independently mounted on the substrate. Each unit can emit different colors, allowing the entire device to achieve multi-color emission capability while maintaining a modular structure that simplifies manufacturing and reduces overall complexity compared to integrating multiple functions in a single package.
2Adaptability or versatility
If multiple light emitting diode packages are mounted to emit different colors, then various colors can be emitted, but the volume of the device increases
Solution Approach 1:
The patent arranges multiple light emitting units in a planar configuration on a substrate, utilizing two-dimensional space efficiently. By spreading units across the substrate surface rather than stacking them vertically or arranging them in three-dimensional space, the device achieves multi-color emission capability while minimizing volume occupation.
3Ease of manufacture
If conventional bonding methods are used for flip-chip LEDs, then manufacturing is simple, but heat dissipation efficiency and reliability are poor
Solution Approach 1:
The patent employs a composite bonding structure consisting of a bonding layer with high thermal conductivity material combined with a reflective layer. This composite structure improves heat dissipation efficiency by conducting heat away from the light emitting units while the reflective layer directs light output. The bonding layer may include materials with high thermal conductivity such as metal alloys or ceramic compounds, creating a multi-functional interface that addresses both thermal management and optical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies manufacturing by emitting multiple colors with a single device, reduces volume, and enhances reliability and heat dissipation, enabling applications like vehicular lamps with multiple functions.
Implementation Method 1
A light emitting diode refers to an inorganic semiconductor device that emits light through recombination of electrons and holes
Implementation Method 2
a first wavelength converter disposed on the first light emitting diode, and the second light emitting unit may include a second light emitting diode and a second wavelength converter disposed on the second light emitting diode
Implementation Method 3
using metal sintered bonding layers for improved heat dissipation and reliability
Data Source
Figure 1~2
Figure 3~4
Figure 5A~5B
AI summary
A light emitting device and a vehicular lamp are provided. The light emitting device comprises: a first light emitting unit; a second light emitting unit that is spaced from the first light emitting unit; and side wall portions, which surround the side surfaces of the first and second light emitting units, and which adjoin the side surfaces of the first and second light emitting units, wherein the first light emitting unit and the second light emitting unit emit light having different peak wavelengths.