Metal Substrate Slit Reservoir for LED Dicing
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Solution Overview
Problem
The existing methods for producing light emitting devices using metal substrates face issues such as generation of shaving dusts during dicing, which can lead to decreased adhesion strength of sealing resin, abnormal luminous flux, and insufficient heat radiation properties, especially when dicing is performed before resin injection, and insufficient connection strength at slits between metal plates.
Innovation Solution
A method involving the formation of slits in a metal substrate for light emitting elements and filling these slits with an insulating material, along with creating recesses as resin reservoirs across the slits, which are then filled with resin to enhance connection strength and prevent dust generation during dicing, while maintaining superior heat radiation properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If dicing is performed before sealing resin injection, then productivity is improved, but shaving dusts are generated causing decreased adhesion strength and abnormal luminous flux
Solution Approach 1:
The patent divides the metal substrate into multiple regions separated by slits, allowing dicing to be performed on individual segments without affecting the entire structure. This segmentation enables early dicing operations while maintaining structural integrity through the slit design that prevents dust contamination during the cutting process.
2Temperature
If a thin metal plate is used as substrate, then heat radiation property is improved, but connection strength at slits becomes insufficient
Solution Approach 1:
The patent creates a composite structure by filling the slits in the metal substrate with insulating material. This composite design maintains the superior heat radiation properties of the thin metal plate while the filled slit provides enhanced connection strength and structural stability at the separation regions.
Solution Approach 2:
The patent applies different properties to different parts of the substrate: the metal plate maintains thinness for heat radiation, while the slit regions are filled with insulating material to provide localized strength enhancement. This local quality differentiation resolves the contradiction between overall heat radiation and localized connection strength.
3Strength
If resin is flown over the back face of metal plate, then connection strength at slit is improved, but heat radiation property is degraded
Solution Approach 1:
Instead of applying resin over the entire back face, the patent confines the resin filling to the slit regions only. This localized approach provides the necessary connection strength at the slit areas while leaving the rest of the metal plate surface exposed to maintain optimal heat radiation properties.
4Ease of manufacture
If masking tape is used to connect slit portions, then ease of manufacture is improved, but connection strength and reliability are insufficient
Solution Approach 1:
The patent uses insulating material as an intermediary substance to fill and bond the slit regions. This intermediary material provides reliable electrical insulation and mechanical connection strength, replacing the inadequate masking tape method while maintaining manufacturing simplicity through a standardized filling process.
Data Source
AI summary
In the production of a light emitting device, in which a plurality of light emitting element parts carrying LED elements are formed on a substrate, and the substrate is diced, generation of shaving dusts is suppressed at the time of the dicing, and breakage of the substrate during the production process can be prevented. In the process of forming a slit crossing a region for forming a light emitting element part in a metal substrate, a recess which serves as a resin reservoir can be formed so as to cross the slit. The slit can be filled with an insulating material, the recess can be filled with a resin, and they both can be cured. A light emitting element part can be formed in the region for forming the light emitting element part, the metal substrate can be cut into units comprising one or a plurality of the light emitting element parts, and can be mounted on a printed circuit board on which a pattern is formed.