LED Metallic Base Heat Dissipation Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Heat dissipation in light-emitting diodes (LEDs) used in motor vehicle headlights is inefficient, posing a challenge for effective thermal management.
Innovation Solution
The LED design features a metallic base body with a large lateral extent compared to its thickness, where multiple LED chips are attached indirectly, and an electrically insulating layer covers the underside to facilitate heat spreading and electrical insulation, with a reflective casing to scatter light and enhance thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If LED chips are mounted on a metallic carrier for heat dissipation, then heat dissipation efficiency is improved, but electrical insulation between the metallic carrier and LED chips becomes problematic
Solution Approach 1:
An electrically insulating layer is introduced as an intermediary between the metallic carrier and the LED chips. This layer serves dual functions: it provides necessary electrical insulation to prevent short circuits while maintaining thermal coupling to allow efficient heat dissipation from the LED chips to the metallic carrier.
Solution Approach 2:
The carrier structure employs composite materials combining metallic base body for thermal management with ceramic or polymer insulating layers for electrical isolation. This composite approach allows simultaneous optimization of thermal conductivity and electrical insulation properties in different regions of the carrier structure.
2Illumination intensity
If multiple LED chips are arranged on the carrier, then light output is improved, but heat generation increases making thermal management more difficult
Solution Approach 1:
The metallic carrier is designed with a plate-like geometry having large lateral extent compared to thickness, creating an extended two-dimensional heat dissipation surface. This dimensional approach allows heat from multiple LED chips to be distributed across a large area, effectively managing thermal load while supporting high light output from multiple chips.
Solution Approach 2:
The metallic carrier serves multiple functions simultaneously: it provides mechanical support for mounting multiple LED chips, acts as a heat sink for thermal management, and functions as an electrical connection element. This multi-functionality allows efficient arrangement of multiple chips without proportionally increasing system complexity.
3Temperature
If the carrier has large lateral extent for heat spreading, then heat dissipation is improved, but the physical size of the LED module increases
Solution Approach 1:
The carrier thickness parameter is optimized to be small compared to lateral dimensions, creating a thin plate structure. This parameter change allows the carrier to provide large lateral heat spreading area while maintaining compact overall profile, effectively decoupling heat dissipation performance from module height.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient heat dissipation and reduces thermal resistance, ensuring optimal performance and longevity of the LEDs in high-temperature applications like motor vehicle headlights.
Implementation Method 1
the arrangement of the light-emitting diode chips of the light-emitting diode as close as possible to a metallic base body allows a particularly efficient heat spread of the heat generated by the light-emitting diode chips during operation
Implementation Method 2
a reflective casing to scatter light and enhance thermal conductivity
Data Source
Figure 1
Figure 2~3
Figure 4
AI summary
The invention relates to a light-emitting diode, comprising a carrier (1) having a mounting surface (11) and at least two light-emitting diode chips (2), which are fixed at least indirectly to the mounting surface (11) on the carrier (1), wherein the carrier (1) comprises a metal main body (12), an outer face (121) of the metal main body (12) comprises the mounting surface (11) and the at least two light-emitting diode chips (2) are connected in parallel to each other.