Metallic Carrier Cavity for LED Thermal Dissipation

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Solution Overview

Problem

Existing component arrangements lack a compact and efficient configuration for electrical components, particularly light-emitting diodes, which hinders thermal dissipation and space utilization.

Innovation Solution

A component arrangement featuring a carrier with a metallic structure having separate planar partial areas and cavities, where electrical components are completely countersunk, allowing for additional elements to be placed on the metallic structure, enhancing thermal dissipation and space efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a component is arranged in a cavity in an insulating carrier, then the component is protected and isolated, but the thermal dissipation is reduced and space utilization is poor

Engineering Contradiction:

Improvecomponent protectionVSAvoidthermal dissipation

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The metallic structure is divided into multiple separate partial areas (first partial area, second partial area, third partial area) that are spatially separated. This segmentation allows different regions to serve different functions: some areas provide thermal management, others provide electrical isolation, and the cavities between them accommodate optical components without thermal interference.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention transitions from traditional planar component arrangement to a three-dimensional configuration with cavities extending into the depth of the metallic structure. Electrical components are arranged in these cavities, allowing vertical stacking and improving space utilization while maintaining thermal pathways through the metallic substrate.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If the carrier has a flat surface without cavities, then the structure is simple and manufacturing is easier, but space utilization is poor and thermal dissipation is reduced

Engineering Contradiction:

Improvestructural simplicityVSAvoidspace utilization

Core Design Contradiction:

Ease of manufactureVSVolume of moving object

Solution Approach 1:

Electrical components are nested within cavities formed by the metallic structure's partial areas. This nesting arrangement allows components to be housed within the structural volume rather than requiring additional external space, improving space utilization while maintaining a compact overall form factor.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Adaptability or versatility

If additional elements are placed on the carrier, then functionality is enhanced, but the arrangement becomes complex and light emission from LEDs is obstructed

Engineering Contradiction:

Improvefunctionality enhancementVSAvoidarrangement complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The invention utilizes the vertical dimension by placing electrical components in cavities below the main carrier surface, while additional functional elements can be arranged on the upper surface. This multi-level arrangement enhances functionality without obstructing light emission paths, as LEDs remain unobstructed on the top surface while electrical components are accommodated below.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

4Ease of manufacture

If the metallic structure has continuous surface, then manufacturing is simpler, but thermal dissipation is reduced and electrical isolation is poor

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidthermal dissipation

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The metallic structure is segmented into separate partial areas (first, second, and third partial areas) that are spatially disconnected. This segmentation creates cavities between them, providing both electrical isolation for components placed in these cavities and maintained thermal pathways through the metallic material, as metal efficiently conducts heat from component mounting areas to heat dissipation regions.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables a compact, thermally efficient, and space-saving arrangement for electrical components, improving heat dissipation and allowing for further elements to be added without obstructing light emission from the light-emitting diodes.

Implementation Method 1

The metallic structure has high thermal conductivity, for example. The metallic structure serves in particular for heat dissipation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The metallic structure can be applied galvanically to the carrier, for example. In particular, a metallic material can be galvanically deposited on the carrier

Methodology Applied

Scientific EffectGalvanic deposition: Electroplating

Data Source

PatentEP2888745B1Electric component assembly

Publication Date: 2020.01.15 TDK ELECTRONICS AG

Figure 1~2
Figure 3A~3C
Figure 3D~3E

AI summary

The invention relates to a component assembly (1) with a carrier (2), said carrier (2) comprising a metal structure (3, 17) having at least one cavity (5, 5a, 5b, 5c, 5d). The component assembly (1) comprises at least one electric component (6, 6a, 6b, 6c) which is at least partially arranged in the cavity (5, 5a, 5b, 5c, 5d).