LED Module With Bent Lead Frames for Candela Distribution
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Solution Overview
Problem
Conventional LED lamps require additional light control elements and molds to achieve desired candela distribution, increasing costs and reducing light-emitting efficiency, while using inclined LED chips or light control elements can be costly and inefficient.
Innovation Solution
The LED module employs bended lead frames to tilt LED chips by different angles, eliminating the need for additional light control elements and allowing rapid alignment of multiple LED chips to achieve optimal candela distribution, reducing manufacturing costs and improving light-emitting efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If additional light control elements are used to achieve desired candela distribution, then lighting effect requirements are met, but manufacturing cost increases and light-emitting efficiency decreases
Solution Approach 1:
The patent removes additional light control elements (lenses, reflectors, diffusers) from the system by bending the lead frame itself to achieve the desired candela distribution. The lead frame is bent at specific angles to tilt LED chips, allowing the structural component to perform both mechanical support and optical directional control functions.
Solution Approach 2:
The lead frame is designed to serve multiple functions: it provides mechanical support for mounting LED chips and simultaneously acts as a light control element by being bent at specific angles to achieve desired candela distribution. This multi-functionality eliminates the need for separate light control components.
2Illumination intensity
If LED chips are arranged inclined with additional molds, then candela distribution requirements are met, but assembly cost rises
Solution Approach 1:
The patent combines the LED chip mounting function and the light direction control function into a single integrated lead frame structure. The lead frame is bent to create inclined mounting surfaces for LED chips while simultaneously providing the structural means to achieve desired candela distribution, eliminating the need for separate molds and assembly steps.
Solution Approach 2:
The lead frame is pre-bent to the required angles before LED chips are mounted. This preliminary action ensures that when chips are attached, they are automatically positioned at the correct angles for optimal light distribution, simplifying the assembly process and reducing manufacturing complexity.
3Illumination intensity
If light control elements are used to correct candela distribution, then lighting requirements are met, but more LED chips are needed increasing electricity consumption
Solution Approach 1:
The patent eliminates light control elements that would otherwise be needed to redirect light, thereby reducing the total number of LED chips required. By bending the lead frame to tilt LED chips at specific angles, the system achieves desired candela distribution more efficiently, reducing electricity consumption.
Data Source
AI summary
A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.