LED Module Bonding Layout for Seamless Large-Area Displays

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Solution Overview

Problem

Large display devices with high resolution and color purity are challenging to manufacture due to complex processes and issues with color uniformity and visible black lines at connection points, especially for outdoor billboards requiring large sizes.

Innovation Solution

A display device design featuring multiple light emitting modules with signal and common lines, a motherboard, and a bonding layer for electrical conductivity, using anisotropic conductive films or pastes, and a method for manufacturing that includes transferring light emitting diodes to a base substrate, cutting into modules, and coupling them to a motherboard with electrical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple light emitting modules are connected through solder mount on printed circuit board, then electrical connection is achieved, but visible black lines appear at connection points due to tolerance issues

Engineering Contradiction:

Improveelectrical connectionVSAvoidvisible black lines

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The display device is divided into multiple light emitting modules that are coupled to a frame structure. Each module contains multiple light emitting diodes arranged in a matrix pattern. This segmentation allows for modular assembly while maintaining overall display continuity, reducing the visibility of connection artifacts through proper module design and spacing.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A bonding layer with electrical conductivity is introduced as an intermediary between the light emitting modules and the motherboard. This bonding layer provides both mechanical support and electrical connection, replacing the traditional solder mount method that caused visible black lines. The bonding layer fills the gaps and tolerance issues between modules, eliminating the harmful visual effect while maintaining reliable electrical connection.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If light emitting diodes are selected and arranged on printed circuit board through wire bonding, then light emitting modules are manufactured, but the manufacturing process becomes complicated and time-consuming for large size displays

Engineering Contradiction:

Improvelight emitting module manufacturingVSAvoidmanufacturing time

Core Design Contradiction:

Ease of manufactureVSLoss of time

Solution Approach 1:

Light emitting diodes are pre-arranged in a matrix pattern on a base substrate before being transferred to the final display structure. This preliminary arrangement allows for efficient bulk handling and assembly, reducing the time required for individual wire bonding operations. The pre-configured modules can be quickly coupled to the frame structure, significantly accelerating the manufacturing process for large size displays.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Multiple light emitting diodes are combined into integrated light emitting modules on a single base substrate. This merging of multiple components into unified modules simplifies the manufacturing process by reducing the number of separate assembly steps. The modules can be handled and installed as single units rather than individual diodes, dramatically reducing manufacturing time and complexity.

Inventive Principle:

Principle #5Merging (Combining)

3Ease of operation

If light emitting modules are coupled through connectors to frame structure, then display device is assembled, but color uniformity and white balance matching become difficult

Engineering Contradiction:

Improvedisplay device assemblyVSAvoidcolor uniformity

Core Design Contradiction:

Ease of operationVSManufacturing precision

Solution Approach 1:

The bonding layer is applied locally at the connection points between light emitting modules and the motherboard, providing targeted electrical and mechanical coupling. This localized approach ensures consistent contact and electrical connection across all modules, facilitating better color uniformity. The bonding layer compensates for local variations and tolerance issues, enabling precise color matching while maintaining ease of assembly.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Facilitates the production of large, high-resolution display devices with improved color purity and reproducibility, simplifying the manufacturing process and reducing the visibility of black lines at connection points.

Implementation Method 1

a bonding layer having electrical conductivity and coupling the multiple light emitting modules to the motherboard

Methodology Applied

Scientific EffectElectrical Conduction: Conduction (electrical)

Implementation Method 2

using anisotropic conductive films or pastes

Methodology Applied

Scientific EffectAnisotropic Conduction: Anisotropy

Data Source

PatentUS12199077B2Display device and method for manufacturing the same

Publication Date: 2025.01.14 SEOUL SEMICONDUCTOR

AI summary

A light emitting apparatus including a substrate, a plurality of light emitting diode devices disposed on the substrate, a light non-transmitting layer disposed on the substrate and having at least one of open regions, and a first conductive bonding layer disposed between the plurality of lighting emitting diode devices and the substrate and electrically contacting the plurality of light emitting diode devices, in which an upper surface of the first conductive bonding layer is placed above the light non-transmitting layer.