LED Module Heat Sink Cavity Insulation Exposure
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Solution Overview
Problem
Light emitting device modules face challenges in achieving optimal optical efficiency due to light absorption by insulating layers, which affects the brightness and efficiency of light emission.
Innovation Solution
A light emitting device module design featuring a heat transfer member with a cavity, where the insulating layer is partially exposed between conductive layers to prevent light absorption, allowing for improved thermal management and optical efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the insulating layer completely covers the heat transfer member, then electrical insulation is improved, but light absorption increases and optical efficiency deteriorates
Solution Approach 1:
The insulating layer is segmented to provide both complete coverage for electrical insulation and exposure for optical efficiency. The insulating layer covers the heat transfer member in regions where electrical insulation is critical (such as where conductive layers contact the heat transfer member), while intentionally exposing portions where light emission occurs. This segmentation allows the system to simultaneously achieve reliable electrical insulation and maintain high optical efficiency by preventing the insulating layer from completely covering the heat transfer member.
2Loss of energy
If the insulating layer is exposed between conductive layers, then optical efficiency is improved by reducing light absorption, but electrical insulation may be compromised
Solution Approach 1:
The insulating layer is applied with local quality variations - fully covering the heat transfer member in regions where electrical insulation is paramount (such as contact areas with conductive layers), and partially exposed in regions where optical performance is critical. This localized differentiation allows the insulating layer to provide electrical insulation exactly where needed while maintaining optical efficiency in light-emitting regions, resolving the contradiction between insulation reliability and light absorption.
3Temperature
If thermal contact between light emitting device and heat transfer member is improved, then thermal dissipation is enhanced, but light absorption by insulating layers may increase
Solution Approach 1:
The insulating layer is segmented to differentiate between thermal management regions and optical emission regions. In thermal contact areas where the light emitting device interfaces with the heat transfer member, the insulating layer is either absent or minimized to enable effective heat dissipation. In contrast, in regions where light emission occurs, the insulating layer is exposed or reduced to minimize light absorption. This spatial segmentation allows simultaneous optimization of both thermal dissipation and optical efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances optical efficiency by reducing light absorption into the insulating layer, leading to increased brightness and cost-effectiveness in manufacturing, while maintaining reliable thermal dissipation.
Implementation Method 1
a heat transfer member having a cavity; at least one light emitting device electrically connected to the first conductive layer and second conductive layer, the at least one light emitting device is thermally contacted an exposed portion of the heat transfer member
Data Source
AI summary
Disclosed herein is a light emitting device module comprising: a heat transfer member having a cavity; first conductive layer and second conductive layer contacting the heat transfer member via an insulating layer, the first conductive layer and the second conductive layer being electrically isolated from each other in accordance with exposure of the insulating layer or exposure of the heat transfer member; and at least one light emitting diode electrically connected to the first conductive layer and second conductive layer, the at least one light emitting device is thermally contacted to an exposed portion of the heat transfer member, wherein the heat transfer member has an exposed portion disposed within the cavity between the first conductive layer and the second conductive layer.