LED Module CCT Correcting Layer Thermal Management
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Solution Overview
Problem
Current LED modules face challenges with thermal management, color temperature shifts due to encapsulation, limited performance guarantees, and safety issues related to isolation and voltage levels, leading to premature failure and inefficiency.
Innovation Solution
The development of an LED module with a circuit board and LEDs coated with a correlated color temperature (CCT) correcting layer and encapsulation layer, which provides thermal conductivity, waterproof and dustproof protection, and high voltage isolation, allowing for improved thermal distribution and optical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If encapsulation layer is applied to protect LED module, then protection against environmental influences is improved, but color temperature shifts and heat transfer reduction occur
Solution Approach 1:
The patent uses a composite encapsulation structure with multiple layers having different properties. The first encapsulation layer (epoxy resin) provides environmental protection, while the second encapsulation layer (silicone rubber) provides thermal management and optical correction. This composite approach allows simultaneous achievement of protection and thermal/optical performance.
Solution Approach 2:
The patent introduces a reflective layer as an intermediary between the LED chip and the encapsulation layers. This reflective layer redirects light that would otherwise be absorbed by the encapsulation material, correcting color temperature shifts and improving light extraction efficiency while maintaining the protective function of the encapsulation.
2Reliability
If encapsulation layer is applied to protect LED module, then protection against environmental influences is improved, but lifespan is reduced due to increased temperature
Solution Approach 1:
The patent uses a composite encapsulation structure with multiple layers having different properties. The first encapsulation layer (epoxy resin) provides environmental protection, while the second encapsulation layer (silicone rubber) provides thermal management and optical correction. This composite approach allows simultaneous achievement of protection and thermal/optical performance.
Solution Approach 2:
The patent introduces a reflective layer as an intermediary between the LED chip and the encapsulation layers. This reflective layer redirects light that would otherwise be absorbed by the encapsulation material, correcting color temperature shifts and improving light extraction efficiency while maintaining the protective function of the encapsulation.
3Ease of operation
If LED module operates at low voltage, then ease of installation and safety certification are improved, but current sharing and thermal runaway resistance are worsened
Solution Approach 1:
The patent segments the LED module into multiple independent LED chips arranged in series-parallel configurations. Each LED chip is individually mounted on the circuit board with its own thermal pathway to the heat sink, enabling better current distribution and thermal management at low voltage operation.
Solution Approach 2:
The patent implements local thermal management by providing individual thermal pathways from each LED chip to the heat sink through the circuit board. This localized approach ensures that each LED operates at optimal temperature regardless of variations in current distribution, preventing thermal runaway while maintaining low voltage operation.
4Device complexity
If LED module is not isolated, then device complexity is reduced, but safety compliance with double insulation standards is worsened
Solution Approach 1:
The patent uses composite encapsulation layers with different dielectric properties. The epoxy resin layer provides primary insulation, while the silicone rubber layer provides secondary insulation and environmental protection. This composite structure inherently provides double insulation without requiring separate isolation components, reducing device complexity while maintaining safety compliance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the LED module's performance by maintaining optimal color temperature, extending lifespan, and ensuring reliable operation under various conditions, including high voltage and harsh environments, while reducing thermal issues and improving efficacy and color rendering index.
Implementation Method 1
the CCT correcting layer and encapsulation layer indices of refraction differ from each other
Implementation Method 2
encapsulation layer providing thermal conductivity
Data Source
AI summary
A LED module (14) including a circuit board (20) provided with electrical conductors and defining opposed circuit board first and second surfaces (61 and 62); a power input (40) electrically coupled to the electrical conductors; LEDs (22) provided on the circuit board first surface (61), each LED (22) defining a light emitting surface (23) facing substantially away from the circuit board (20), the LEDs (22) being electrically coupled to the electrical conductors for being powered when the power input is powered; an encapsulation layer (50) having an encapsulation layer index of refraction and covering the circuit board first surface (61) and the LEDs (22); a CCT correcting layer (48) having a CCT correcting layer index of refraction and coating at least part of at least one of the light emitting surfaces (23) and provided between the at least part of the at least one of the light emitting surfaces (23) and the encapsulation layer (50). The CCT correcting layer and encapsulation layer indices of refraction differ from each other.