LED Module Compact Design via Preliminary Chip Mounting
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Solution Overview
Problem
Conventional LED module manufacturing methods face challenges in reducing module size due to interference from capillary bonding tools and heat-induced deformation of the case, leading to insufficient bonding strength and reduced module life.
Innovation Solution
A method involving the mounting of an LED chip on a lead with a protective resin covering the chip before forming a case with a reflective surface, using eutectic bonding and incorporating fluorescent substances in resins to enhance bonding strength and prevent heat-induced deformation, allowing for a compact and long-lasting LED module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the case is formed before mounting the LED chip, then the case can be precisely positioned, but the capillary for bonding the wire onto the LED chip interferes with the case, requiring excessive space between the reflector and LED chip, which hinders size reduction of the LED module
Solution Approach 1:
The LED chip is mounted on the lead frame before the case is formed. This preliminary action allows the capillary to operate without interference from the case, enabling compact design with reduced space between the reflector and LED chip, thus achieving size reduction of the LED module
2Reliability
If the case is formed before mounting the LED chip, then the case structure is established, but the case is excessively heated during LED chip mounting, causing deformation or discoloration, which leads to insufficient bonding strength and reduced LED module life
Solution Approach 1:
The LED chip is mounted on the lead frame before the case is formed and heated. By performing the bonding operation first, the case is not present to be heated, thus preventing thermal deformation or discoloration. This ensures proper bonding strength and extends LED module life
3Ease of manufacture
If excessive space is secured between the reflector and LED chip to avoid capillary interference, then the bonding process can be completed, but the LED module size cannot be reduced
Solution Approach 1:
The LED chip is mounted on the lead frame before the case is formed. This allows the bonding process to proceed without requiring excessive space between the reflector and LED chip, as the case is not yet present to cause interference. The capillary can operate in the available space, enabling both feasible bonding and compact module size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of a compact, high-brightness LED module with improved bonding strength and extended lifespan by avoiding heat-related issues and allowing for precise control of the LED chip's placement and bonding process.
Implementation Method 1
the protective resin contains a fluorescent substance that emits light due to excitation by light from the LED chip, where the emitted light has a wavelength different from the wavelength of the light from the LED chip
Implementation Method 2
the sealing resin contains a fluorescent substance that emits light due to excitation by light from the LED chip, where the emitted light has a wavelength different from the wavelength of the light from the LED chip
Implementation Method 3
a case covering part of the lead and including a reflective surface surrounding the LED chip
Data Source
AI summary
A method for manufacturing an LED module is provided that includes the steps of mounting an LED chip 2 on an obverse surface of leads 1A′, 1B′, and after the step of mounting the LED chip 2, providing a case 6 that covers part of the leads 1A′, 1B′ and includes a reflective surface 61 surrounding the LED chip 2 in an in-plane direction of the leads 1A′, 1B′. With this arrangement, there is no risk that the arm for handling the LED chip 2 interferes with the case 6. This allows the distance between the reflective surface 61 and the LED chip 2 to be reduced, and hence allows making the LED module more compact.