LED Module Compact Design for High Contrast
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Solution Overview
Problem
Conventional LED modules for electronic message displays face challenges in size reduction and achieving high contrast due to the need for space between LED chips, wires, and electrodes, which affects the close arrangement of LED chips and results in poor color mixing and contrast, especially when the modules are densely packed.
Innovation Solution
The design includes a compact LED module with LED chips arranged to form a triangle, where the first chip emits red light and the second and third chips emit blue and green light, facing each other across a wire, with a dark-colored module substrate and sealing resin to enhance contrast and reduce module size, and a common electrode connected to all chips to facilitate efficient light mixing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If LED chips are arranged close to each other for size reduction and proper color mixing, then module size is reduced and color mixing is improved, but space is insufficient for arranging wires and electrodes without mutual contact or short-circuiting
Solution Approach 1:
The patent combines multiple functions into the module substrate: it serves as both the mechanical support for mounting LED chips and as the electrode structure itself. The substrate includes conductive regions that function as electrodes, eliminating the need for separate wire connections and reducing the number of discrete components that need to be arranged.
Solution Approach 2:
The module substrate acts as an intermediary structure that integrates the mounting function and electrical connection function. By incorporating conductive regions directly into the substrate, it mediates between the LED chips and the external circuitry, eliminating the need for separate wire arrangements and reducing spatial requirements.
2Measurement precision
If LED modules are arranged at high density for high resolution, then display resolution is improved, but module substrates occupy large proportion of display region and appear white when LED chips are OFF, leading to poor contrast
Solution Approach 1:
The patent changes the color appearance of the module substrate by applying a black color coating to its lower surface. This black coating ensures that when LED chips are in the OFF state, the substrate appears dark rather than white, significantly improving the contrast ratio of the display while maintaining high density arrangement for high resolution.
3Reliability
If wires and electrodes are arranged with sufficient space to prevent mutual contact and short-circuiting, then reliability is improved, but module size increases and LED chips cannot be arranged close to each other
Solution Approach 1:
The patent merges the electrode function into the module substrate structure itself. The substrate includes conductive regions that serve as electrodes, eliminating the need for separate wire connections. This integration maintains electrical connection reliability while significantly reducing the space required for electrical connections, allowing LED chips to be arranged closer together.
Solution Approach 2:
The patent extracts the wire connection function from the overall assembly and replaces it with integrated conductive regions in the substrate. By removing the separate wire components and their associated routing space, the design maintains electrical reliability through the substrate's inherent conductive paths while reducing the overall module size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a compact size reduction of the LED module while achieving balanced color mixing and enhanced contrast in LED dot matrix displays, especially when densely packed, by minimizing unnecessary space and using dark-colored substrates to create a deep black background for improved visibility.
Implementation Method 1
The first, the second and the third LED chips emit red light, blue light and green light, respectively
Implementation Method 2
The first, the second and the third LED chips are covered by a light-transmitting sealing resin
Implementation Method 3
the module substrates 91, which are made of glass fiber-reinforced epoxy resin, are milk white. Thus, even when all the LED modules X are in the OFF state, the display region of the dot matrix display appears white, which leads to a poor contrast
Data Source
AI summary
An LED module A1 includes LED chips 3R, 3G, 3B, and a module substrate 1 on which the LED chips 3R, 3G, 3B are mounted. A wire 4R is connected to the LED chip 3R, and the LED chips 3G and 3B are arranged to face each other across the wire 4R. With this arrangement, the LED module A1 is reduced in size, and red light, green light and blue light are properly mixed.