Light Emitting Module Conductive Pad Wire Bonding Elimination

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Solution Overview

Problem

Conventional head lamps using LEDs face reliability issues due to exposure of wires and light emitting devices, leading to durability problems.

Innovation Solution

A light emitting module design that electrically connects the light emitting device to the circuit board using a conductive pad instead of wire bonding, incorporating a metal board with a cavity, insulation layer, and a glass cover with anti-reflective coating to enhance durability and protect internal components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If wire bonding is used to electrically connect the light emitting device to the circuit board, then electrical connection is achieved, but the wires are exposed and susceptible to damage, reducing reliability

Engineering Contradiction:
ImprovereliabilityVSAvoidwire damage
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent extracts the wire bonding method and replaces it with a direct pad-to-pad connection structure. The insulation board is removed, and the circuit board's pad directly connects to the light emitting device's pad, eliminating the exposed wire component that causes reliability issues.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces a conductive adhesive as an intermediary material to create a direct electrical connection between the circuit board pad and the light emitting device pad. This mediator eliminates the need for exposed wires while maintaining electrical connectivity and improving reliability.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If a glass cover with anti-reflective coating is added to protect components, then durability and light transmission are improved, but device complexity increases

Engineering Contradiction:
ImprovedurabilityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The glass cover is designed to perform multiple functions simultaneously: it protects the internal components from damage, provides optical clarity through its anti-reflective coating to transmit light efficiently, and serves as a structural element of the head lamp assembly. This multi-functionality justifies the added complexity by delivering multiple benefits from a single component.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution improves the reliability and durability of the light emitting module by preventing wire damage and efficiently transmitting light, while also physically protecting the light emitting device and wire components.

Implementation Method 1

a glass cover with anti-reflective coating to enhance durability and protect components

Methodology Applied
Scientific EffectAnti-reflective coating: Anti-Reflective Coating

Implementation Method 2

A Light Emitting Diode (LED) is a type of semiconductor element for converting electric energy into light

Methodology Applied
Scientific EffectLight emitting diode: Light Emitting Diode

Implementation Method 3

a reflector to reflect the light emitted from the light emitting module

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 4

a lens to refract the light emitted from the light emitting module and the light reflected by the reflector

Methodology Applied
Scientific EffectRefraction: Refraction

Data Source

PatentUS9169988B2Light emitting module and head lamp including the same
Publication Date: 2015.10.27 SUZHOU LEKIN SEMICON CO LTD
  • US9169988B2 patent drawing
  • US9169988B2 patent drawing
  • US9169988B2 patent drawing

AI summary

Disclosed herein is a light emitting module. The light emitting module according to an exemplary embodiment includes a circuit board which has a cavity and includes a metal board, an insulation layer, and a circuit pattern, an insulation board disposed in the cavity, at least one light emitting device disposed on the insulation board, first and second pads disposed on the insulation board to be electrically connected with the light emitting device, and a conductive pad for electrically connecting the second pad and the circuit pattern.