LED Module Copper Base Solder Heat Dissipation
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Solution Overview
Problem
Conventional LED modules face challenges in heat dissipation and complex manufacturing processes due to the generation of heat by high-output LED chips, which reduces emission efficiency and requires intricate steps for heat transfer member arrangement.
Innovation Solution
An LED module design featuring a copper-based base member with an insulating layer and conductive wiring patterns, where through portions in the insulating layer allow for solder-based heat dissipation between the package and the base member, eliminating the need for a separate heat transfer member and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat transfer member is arranged between the package and the base member to dissipate heat, then the heat dissipation effect is enhanced, but the manufacturing process becomes complex
Solution Approach 1:
The patent removes the heat transfer member from the structure, extracting the unnecessary component that complicated the manufacturing process. The insulating layer is partially removed to create a through portion, allowing the solder to directly contact the base member for heat dissipation without requiring a separate heat transfer member.
Solution Approach 2:
The patent merges the heat dissipation function with the existing solder connection structure. The solder that originally served only for electrical connection now also serves as the heat transfer path by directly contacting the base member through the through portion, combining multiple functions into a single element.
2Reliability
If multiple layers (insulating layer, wiring patterns, resist) are stacked on the base member to provide insulation and electrical connection, then the electrical functionality is achieved, but the manufacturing process requires multiple complex steps
Solution Approach 1:
The patent extracts and removes the resist layer from the multi-layer structure, simplifying the manufacturing process. The through portion is formed by removing the insulating layer in the region where the package is mounted, eliminating the need for complex multi-step layering and removal processes.
3Power
If the LED chip generates high heat due to high output power, then the light quantity is sufficient, but the emission efficiency decreases due to negative temperature coefficient
Solution Approach 1:
The patent introduces the solder as an intermediary heat transfer medium between the package and the base member. The solder fills the through portion and provides a direct thermal path from the LED chip through the package to the high thermal conductivity base member, effectively mediating heat transfer to maintain emission efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively dissipates heat from LED chips, enhancing emission efficiency while streamlining the manufacturing process by integrating heat dissipation directly through the solder connection, thus reducing thermal resistance and manufacturing complexity.
Implementation Method 1
a base member made of copper-based metal
Implementation Method 2
a heat dissipation member made of a solder is arranged between a bottom surface of the package and the base member
Data Source
AI summary
An LED module includes: a package having electrodes provided on the outer surface of opposing sidewalls, and a light-emitting element connected to the electrodes and mounted on the package; a base member having a copper metal; an insulating layer stacked on the surface of the base member and having an insulating material; and a conductive wiring pattern connected to the electrodes by soldering and formed on the surface of the insulating layer. The insulating layer has a through-hole formed by removing a part of the section where the package is positioned, and a heat dissipation unit formed by soldering between the back surface of the package and the base member, which face one another with the through-hole interposed therebetween.