LED Lighting Module Assembly for Heat Dissipation and Crack Prevention
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Solution Overview
Problem
Existing lighting modules face challenges in heat dissipation efficiency and are prone to cracks in connection members, particularly in lighting devices using light emitting diodes (LEDs), which also require improved design flexibility and color emission capabilities.
Innovation Solution
A lighting module design featuring a heat dissipation plate with a recessed circuit board, ribbon-shaped connection members with specific dimensions, and an adhesive member to secure the light source portion, which includes a support member with light emitting chips and a wavelength conversion layer, sealed by a resin member, enhances heat dissipation and prevents cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional lighting modules are used, then manufacturing is simpler, but heat dissipation efficiency is insufficient
Solution Approach 1:
The lighting module is divided into distinct functional segments: a light source portion containing light emitting chips, a heat dissipation plate for thermal management, and a circuit board for electrical connections. This segmentation allows each component to be optimized independently - the heat dissipation plate can be designed with enhanced thermal conductivity and surface area while the light source portion maintains manufacturing simplicity
Solution Approach 2:
A connection member acts as an intermediary element between the light source portion and the circuit board, providing both mechanical support and electrical connection. This intermediary structure enables effective heat dissipation from the light emitting chips to the heat dissipation plate while maintaining electrical connectivity to the circuit board, resolving the contradiction between thermal management and structural simplicity
2Strength
If connection members are made thicker to prevent cracks, then strength increases, but electrical conductivity decreases
Solution Approach 1:
The connection member is designed with non-uniform thickness distribution, featuring a thicker portion at the light source portion end for mechanical strength and crack prevention, and a thinner portion at the circuit board end for optimal electrical conductivity. This local quality variation allows the single component to simultaneously satisfy both strength and conductivity requirements
Solution Approach 2:
The connection member is constructed using composite materials that combine properties of different materials - potentially using materials with high strength-to-weight ratios and excellent thermal conductivity while maintaining electrical conductivity. This composite approach enables the connection member to achieve both mechanical robustness and electrical performance without compromising either aspect
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves heat dissipation efficiency, prevents cracks in connection members, and enhances the brightness and color output of the lighting device, thereby increasing reliability and electrical connectivity.
Implementation Method 1
a heat dissipation plate having an upper surface and a recess portion concave from an upper surface
Implementation Method 2
an adhesive member that adheres the light source portion to the heat dissipation plate
Implementation Method 3
a plurality of light emitting devices having a plurality of light emitting chips on the support member and a wavelength conversion layer on the plurality of light emitting chips
Data Source
AI summary
A lighting device disclosed in an embodiment of the invention includes a heat dissipation plate having a recess portion; a circuit board accommodated in the recess portion of the heat dissipation plate and having pads; a light source portion having bonding pads; connection members respectively connecting between the pads and the bonding pads; and an adhesive member that adheres the light source portion to the heat dissipation plate. The light source portion includes a support member; light emitting devices having light emitting chips and a wavelength conversion layer; and a resin member. Each of the connection members has a ribbon shape, and a width of each of the connection members is more than twice the thickness of each of the connection members, and each of the connection members may include two ends respectively connected to the bonding pads and the pads, and a center portion extending convexly between the two ends.