Multi-Pixel LED Module Layout for Short-Circuit-Free Cross-Matrix Wiring

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Solution Overview

Problem

Multi-pixel LED modules with cross-matrix circuits are complex due to the need for precise voltage application and current path management to avoid short circuits, making them difficult to manufacture and maintain.

Innovation Solution

A pixel design for multi-pixel LED modules that incorporates lead-frame sections with protrusions and conductive layers to simplify the configuration, allowing for direct electrical contact and connection of adjacent pixels, enabling a cross-matrix circuit without short circuits by using conductive paths that do not intersect.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a cross-matrix circuit is realized by conductor paths on a first level of a circuit board with vias to avoid short circuits, then short circuits at crossing points are avoided, but the multi-pixel LED module becomes very complex

Engineering Contradiction:
Improveavoid short circuitsVSAvoidmodule complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent divides the circuit board into multiple levels (first level and second level) with distinct functions. The first level handles row connections while the second level handles column connections, segmenting the complex routing problem into manageable layers that reduce overall circuit complexity while maintaining reliability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a two-dimensional planar routing problem to a three-dimensional solution by adding vertical dimension through vias connecting first and second levels. This dimensional change allows conductor paths to cross without intersecting on the same plane, eliminating short circuits while simplifying the routing architecture.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If precise voltage application and current path management are implemented to avoid short circuits, then short circuit prevention is achieved, but manufacturing and maintenance become difficult

Engineering Contradiction:
Improveavoid short circuitsVSAvoidmanufacturing difficulty
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The circuit board is segmented into functional layers with dedicated purposes. The first level is optimized for row pixel connections while the second level handles column connections, allowing each layer to be manufactured and tested independently, thereby simplifying the overall manufacturing process while ensuring reliable current path management.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Vias serve as intermediary elements that connect the first and second levels. These standardized intermediate components facilitate controlled current flow between levels without requiring complex direct routing, making the system easier to manufacture and maintain while preventing short circuits.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Adaptability or versatility

If conductor paths are used to connect pixels in a cross-matrix circuit, then pixel control is enabled, but the configuration becomes complex

Engineering Contradiction:
Improvepixel control capabilityVSAvoidcircuit configuration
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent segments the pixel control architecture into row-based and column-based connection systems operating on different levels. This segmentation enables independent control of rows and columns, providing versatile pixel addressing while keeping each subsystem's configuration simple and manageable.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

By implementing row and column connections on separate vertical levels, the patent adds a dimensional separation to the control architecture. This allows complex cross-matrix control functionality to be achieved through simple, organized routing on each level without the complexity of two-dimensional path intersections.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11837688B2Pixel, multi-pixel LED module and method of manufacture
Publication Date: 2023.12.05 AMS OSRAM INT GMBH
  • US11837688B2 patent drawing
  • US11837688B2 patent drawing
  • US11837688B2 patent drawing

AI summary

In an embodiment a pixel for a multi-pixel LED module includes a first light-emitting semiconductor chip having a first upper chip side and a first lead-frame section having a first upper side, a first contacting protrusion and a second contacting protrusion, wherein the first contacting protrusion and the second contacting protrusion extend from the first upper side, and wherein the first light-emitting semiconductor chip is embedded in an electrically insulating material such that the first upper side is covered by the electrically insulating material and the first upper chip side and the contacting protrusions are exposed.