LED Module with Die-Bonding Opening for Heat Dissipation
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Solution Overview
Problem
Conventional LED modules face challenges in efficiently dissipating heat generated by LED chips and utilizing light emitted, as direct mounting on ceramic substrates hinders heat dissipation while metal wiring patterns can darken, reducing light efficiency.
Innovation Solution
An LED module design featuring leads with die-bonding portions having openings filled with a white support member, which supports the LED unit and facilitates heat transfer through metal leads while reflecting light using a white resin to enhance both heat dissipation and light utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the LED unit is directly mounted on a ceramic substrate, then the structure is simple, but heat dissipation is insufficient
Solution Approach 1:
The patent introduces a die-bonding portion as an intermediary component between the LED unit and the substrate. This die-bonding portion includes a metal layer with high thermal conductivity that facilitates heat dissipation from the LED unit, while still maintaining a relatively simple overall structure. The metal layer acts as a thermal bridge that efficiently transfers heat away from the LED chip.
2Temperature
If a metal wiring pattern is used for mounting, then heat dissipation is improved, but the surface color changes over time reducing light efficiency
Solution Approach 1:
The patent applies local quality by providing a white coating only on the surface of the die-bonding portion that is exposed and visible to light, while the internal metal layer remains uncovered for heat dissipation. This localized treatment allows the metal to perform its heat dissipation function while the white coating maintains stable light reflection properties without undergoing color change.
Solution Approach 2:
The die-bonding portion is constructed as a composite structure with a metal layer providing thermal conductivity and a white coating layer providing stable light reflection. This composite material approach combines the advantages of both metals (heat dissipation) and non-metals (color stability) in a single component.
3Reliability
If a white non-metal substrate is used, then light reflection is efficient, but heat dissipation capability is reduced
Solution Approach 1:
The patent segments the functions of heat dissipation and light reflection into different layers of the die-bonding portion. The metal layer internally handles heat dissipation through its high thermal conductivity, while the external white coating layer handles light reflection. This functional segmentation allows both requirements to be met simultaneously without compromise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves high heat dissipation and light efficiency by transferring heat through metal leads and reflecting light, preventing LED chip deterioration and improving reliability, similar to using a white non-metal substrate.
Implementation Method 1
heat generated during light emission of the light-emitting element is readily transferred to the die-bonding portion and released to the outside through the first lead
Implementation Method 2
part of the light emitted from the light-emitting element toward the die-bonding portion side in the thickness direction is reflected by the white support member filling the opening
Data Source
AI summary
A lead 1 includes a die-bonding portion 11 with an opening 11a penetrating in a thickness direction. Another lead 2 is spaced from the lead 1. An LED unit 3 includes an LED chip 30 with a electrode terminal 31 connected to the lead 1 and another electrode terminal 32 connected to the lead 2. The LED unit 3, mounted on a surface of the die-bonding portion 11 on a first side in z direction, overlaps the opening 11a. A wire 52 connects the lead 2 and the electrode terminal 32. A support member 4 supporting the leads 1-2 is held in contact with another surface of the die-bonding portion 11 on a second side in z direction. These arrangements ensure efficient heat dissipation from the LED chip 30 and efficient use of light emitted from the LED chip 3.