LED Module ESD Protection via NC Pin and Conductor
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Solution Overview
Problem
Existing LED modules in liquid crystal display backlights are prone to damage from electro-static discharge (ESD) during the fabrication process, with a single LED chip or chips connected in series being susceptible to damage from as little as 5 KV of ESD, leading to manufacturing challenges and increased costs.
Innovation Solution
The design incorporates a circuit substrate with a first LED chip having at least three pins, including a no-connection (NC) pin, a non-conductive housing with fixing pins and a conductor, and a conductive line that connects the conductor to the NC pin, allowing ESD energy to be induced to a metal backplane, thereby protecting the LED chip from ESD without the need for additional Zener-diodes, maintaining the LED chip's brightness and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional LED module design without ESD protection is used, then manufacturing process is simple and cost is low, but LED chip is vulnerable to ESD damage (5 KV threshold)
Solution Approach 1:
The patent introduces an intermediary ESD protection circuit between the LED chip and power supply that acts as a mediator to divert ESD energy away from the LED chip. This circuit includes ESD protection components connected in parallel with the LED chip, providing a safe discharge path for electrostatic energy while maintaining the LED's normal operation.
Solution Approach 2:
The patent converts the harmful ESD energy into a beneficial discharge path by designing the ESD protection circuit to safely guide and dissipate electrostatic energy. The circuit transforms the potentially damaging ESD event into a controlled discharge process that protects the LED chip while maintaining system functionality.
2Reliability
If ESD protection components (Zener-diodes) are added, then ESD protection is improved, but manufacturing process complexity and cost increase
Solution Approach 1:
The patent merges the ESD protection function with the existing LED module structure by integrating the protection circuit into the same substrate and using shared connection paths. This combination approach allows ESD protection to be achieved without adding separate, independent protection modules, thereby simplifying the manufacturing process.
Solution Approach 2:
The patent designs the ESD protection circuit to serve multiple functions: it provides ESD protection, maintains electrical connection stability, and works with the existing LED chip configuration. This multi-functionality reduces the need for additional specialized components and simplifies the overall manufacturing process.
3Reliability
If ESD protection components are added, then ESD resistance is improved, but LED chip brightness may be affected
Solution Approach 1:
The patent applies local quality by designing the ESD protection circuit to operate independently in specific regions while leaving the LED chip's light-emitting regions unaffected. The protection circuit is configured to handle ESD energy locally without interfering with the electrical current paths that generate light, thereby maintaining brightness.
Solution Approach 2:
The patent segments the electrical circuit into distinct functional paths: one path for normal LED operation and another path for ESD discharge. This segmentation ensures that ESD protection activities occur in isolation from the light-generating processes, preventing any negative impact on LED brightness and performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This ESD protection design effectively directs ESD energy away from the LED chip to the metal backplane, ensuring the LED module's functionality and brightness are preserved, while reducing manufacturing complexity and costs by eliminating the need for extra components like Zener-diodes, resulting in a robust and cost-effective solution.
Implementation Method 1
the LED module is damaged by ESD. Usually, a single LED chip or LED chips connected in series of the LED module will be damaged by ESD of only 5 KV
Implementation Method 2
The conductive line is disposed on the circuit substrate and is electrically connected between the conductor and the first NC pin
Data Source
AI summary
A light emitting diode (LED) module and a display device adopting the same LED module are provided. The LED module includes a circuit substrate, a LED chip, a connector and a conductive line. The LED chip has at least three pins, and the LED chip is fixed on the circuit substrate through the pins, wherein one of the pins is defined as a no connection (NC) pin. The connector includes a non-conductive housing, at least one fixing pin and a conductor. The fixing pin is connected to the non-conductive housing, and the non-conductive housing is fixed on the circuit substrate through the said at least one fixing pin. A part of the non-conductive housing is covered with the conductor. The conductive line is disposed on the circuit substrate and is electrically connected between the conductor and the NC pin.