LED Module Expansion Mounting for Heat Sink Thermal Stress

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Solution Overview

Problem

Existing methods for mounting LED modules to heat sinks require additional manufacturing steps and are prone to reliability issues due to temperature-related stress, especially when using adhesives.

Innovation Solution

A method involving the placement of an LED module into a hole in the heat sink, where a portion of the module is expanded to secure it without the need for threads or adhesives, using a tool to deform the module and ensure a reliable, cost-efficient attachment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the LED module is screwed to the heat sink, then the mounting is secure, but additional manufacturing steps are required to provide threads on both the heat sink and LED housing

Engineering Contradiction:

Improvemounting securityVSAvoidmanufacturing steps

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The invention extracts the threading requirement from the mounting system. Instead of requiring threads on both the heat sink and LED housing, the solution uses a simple hole in the heat sink and an expandable portion on the LED module, eliminating the need for complex threading operations while maintaining secure mounting.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention inverts the traditional mounting approach. Rather than creating external threads on both components for engagement, the solution has the LED module expand internally within the heat sink hole, creating a friction-fit mounting that eliminates the need for pre-formed threads.

Inventive Principle:

Principle #13The other way round (Inversion)

2Ease of manufacture

If adhesives are used to attach the LED module to the heat sink, then mounting is simplified, but reliability reduces over time due to temperature-related stress

Engineering Contradiction:

Improvemounting processVSAvoidlong-term reliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The LED module's own structure is used to create the mounting mechanism. The expandable portion of the LED module serves both as a structural component and as the mounting mechanism, expanding to create friction against the heat sink hole walls, eliminating the need for separate adhesives or fasteners.

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The invention uses the radial expansion of the LED module's portion to create a secure fit. The expansion creates circumferential contact pressure against the hole walls, similar to how spherical objects create point contact pressure, ensuring reliable mechanical attachment without temperature-sensitive adhesives.

Inventive Principle:

Principle #14Spheroidality (Curvature)

3Reliability

If threads are provided on the heat sink and LED housing, then secure mounting is achieved, but the device complexity increases

Engineering Contradiction:

Improvemounting securityVSAvoidstructural complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The invention extracts the threading complexity from the system. Instead of requiring threaded features on both the heat sink and LED housing, the solution uses a simple hole in the heat sink and an expandable portion on the LED module, significantly reducing structural complexity while maintaining secure mounting.

Inventive Principle:

Principle #2Taking out (Extraction)

4Ease of manufacture

If adhesives are used for mounting, then the mounting process is simplified, but the mount becomes sensitive to temperature changes and stress

Engineering Contradiction:

Improvemounting processVSAvoidtemperature sensitivity

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The invention changes the physical state of the LED module's portion from unexpanded to expanded. This parameter change creates the mounting force through elastic deformation, providing a temperature-stable mechanical attachment that does not rely on adhesive properties which degrade under thermal stress.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enhances reliability over time by eliminating the need for threads and adhesives, reducing manufacturing defects, and maintaining thermal conductivity while being cost-effective and applicable to both manual and automated processes.

Implementation Method 1

The step of expanding a portion of the LED module may comprise deforming a portion of the LED module such that the circumference of the deformed portion is expanded beyond the circumference of the hole

Methodology Applied

Scientific EffectDeformation: Deformation

Data Source

PatentUS8492179B2Method of mounting a LED module to a heat sink

Publication Date: 2013.07.23 SIGNIFY HOLDING BV

AI summary

A method of mounting a light emitting diode (LED) module (100) to a heat sink (102), the method comprising the steps of placing the LED module (100) in a hole (120) in the heat sink (102); and expanding a portion of the LED module (100) such that the LED module (100) is secured to the heat sink (102). The method provides a cost efficient way of securing an LED module to a heat sink where the mount has a high reliability over time.