LED Illuminating Module With Flexible Sealing And Integrated Heat Dissipation
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Solution Overview
Problem
Conventional LED street illuminating apparatuses face challenges in assembly time, component displacement, moisture invasion, and heat dissipation efficiency due to delicate components and limited heat sink area, leading to reduced lifespan and performance.
Innovation Solution
The design incorporates a cover body with through holes, flexible elements made of rubber for heat absorption and moisture prevention, and a heat conducting layer, along with a light-emitting component on a circuit board, where the flexible element and lens elements are positioned to secure components and enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional LED illuminating apparatus uses multiple delicate components (cover body, lens, light emitting diodes, heat dissipating fins), then the illumination function is achieved, but the assembling and positioning time increases and labor is wasted
Solution Approach 1:
The patent combines multiple separate components (cover body, lens, light emitting diodes, heat dissipating fins) into an integrated module where the lens is directly formed as part of the cover body structure, and the light emitting diodes are mounted directly on the heat dissipating fins without requiring separate mounting brackets or positioning fixtures. This merging reduces the number of assembly steps and positioning operations required.
Solution Approach 2:
The cover body is designed to serve multiple functions simultaneously: it acts as the structural housing, the lens for light distribution, the mounting platform for light emitting diodes, and the heat dissipating structure. This multi-functionality eliminates the need for separate dedicated components for each function, thereby reducing assembly complexity and time.
2Reliability
If conventional LED illuminating apparatus uses separate components for light emitting diodes and heat dissipating fins, then the illumination function is achieved, but the internal components are easily displaced due to external force or impact
Solution Approach 1:
The light emitting diodes are mounted directly on the heat dissipating fins, which are integrated into the cover body structure. This direct mounting eliminates intermediate mounting brackets or positioning fixtures that could become displaced. The light emitting diodes and heat dissipating fins form a unified assembly that resists displacement from external forces.
Solution Approach 2:
The patent employs a flexible sealing structure (thin film or shell) between the internal components and the external environment. This flexible seal protects the light emitting diodes and heat dissipating fins from displacement while maintaining the structural integrity of the module under external forces.
3Reliability
If conventional LED illuminating apparatus allows moisture exposure, then the structure is simple, but moisture invades into the internal components causing short circuit or breakage
Solution Approach 1:
The patent employs a flexible sealing structure (thin film or shell) that encloses the internal components (light emitting diodes, circuit board, heat dissipating fins) to prevent moisture invasion. This seal maintains protection against moisture while allowing the overall structure to remain relatively simple and flexible for installation.
Solution Approach 2:
The patent introduces a sealing layer or protective film as an intermediary between the internal components and the external moist environment. This intermediary layer blocks moisture from reaching the light emitting diodes and circuit board while allowing heat dissipation and maintaining the structural simplicity of the module.
4Illumination intensity
If high power light emitting diodes are used to provide sufficient light, then the illumination intensity is improved, but the temperature increases and heat dissipation efficiency decreases
Solution Approach 1:
The patent combines the light emitting diodes with the heat dissipating fins in a unified structure where the light emitting diodes are mounted directly on the fins. This integration ensures that the heat generated by the light emitting diodes is immediately transferred to the fins for dissipation, preventing heat accumulation while maintaining high illumination intensity.
Solution Approach 2:
The patent employs a thermal conductive material or thin film layer between the light emitting diodes and the heat dissipating fins to enhance heat transfer. This thermal interface material improves heat dissipation efficiency while allowing the high power light emitting diodes to operate at high illumination intensity without excessive temperature rise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces assembly time, prevents moisture invasion, improves heat dissipation efficiency, and prolongs the lifespan of LED illuminating apparatuses by securely positioning components and effectively managing heat.
Implementation Method 1
flexible elements made of rubber for heat absorption
Implementation Method 2
heat conducting layer
Implementation Method 3
a plurality of lens elements... the lights emitted from the light emitting diodes are outputted through the lens elements respectively
Data Source
AI summary
An illuminating module includes a cover body, a plurality of lens elements, a flexible element and a light-emitting component. The cover body has a plurality of first through holes. The lens elements are opposite to the first through holes, respectively, and the size of each lens element is made compatible with the size of each first through hole. The lens elements are disposed between the flexible element and the cover body. The light-emitting component has a circuit board and a plurality of light emitting diodes. The light emitting diodes are disposed on the circuit board and opposite to the lens elements, respectively. The lights emitted from the light emitting diodes are outputted through the lens elements respectively.