LED Module FPC Slot Bonding Design

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Solution Overview

Problem

Conventional LED light bars connected to flexible printed circuits (FPCs) via pressure bonding suffer from insufficient bonding strength, leading to poor contact and peeling issues due to external forces, as the bonding area is limited and lacks structural support.

Innovation Solution

The LED module incorporates a circuit board with a slot or notch that allows the FPC to pass through, providing additional bonding points and structural support, ensuring secure electrical connections between the LED light bar, FPC, and control circuit board, thereby enhancing the module's reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If pressure bonding process is used to connect LED light bar and FPC, then electrical connection is achieved, but bonding strength is insufficient to resist external force

Engineering Contradiction:
Improvebonding strengthVSAvoidbonding area
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent transitions from a two-dimensional surface bonding approach to a three-dimensional through-hole penetration approach. The FPC is inserted through a slot in the circuit board, creating vertical penetration rather than surface-level contact. This dimensional change allows the FPC to pass through the entire thickness of the circuit board, providing mechanical anchoring that significantly enhances bonding strength and resistance to external forces.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The FPC is nested within the circuit board structure by passing through the slot. The FPC is positioned inside the slot opening and secured with adhesive, creating a nested configuration where the FPC is embedded within the circuit board's structural framework. This nesting provides mechanical support and prevents peeling while maintaining electrical connection.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Reliability

If limited bonding area is used for connecting FPC to LED light bar, then manufacturing is simplified, but peeling-off problem occurs under external force

Engineering Contradiction:
Improveconnection stabilityVSAvoidbonding area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent transitions from a two-dimensional surface bonding approach to a three-dimensional through-hole penetration approach. The FPC is inserted through a slot in the circuit board, creating vertical penetration rather than surface-level contact. This dimensional change allows the FPC to pass through the entire thickness of the circuit board, providing mechanical anchoring that significantly enhances bonding strength and resistance to external forces.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The connection structure is segmented into multiple functional zones: the slot providing mechanical guidance, the adhesive layer providing bonding, and the FPC bending part providing flexibility. This segmentation allows each component to perform its specific function optimally, with the slot and adhesive working together to prevent peeling while the limited bonding area maintains manufacturing simplicity.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS8052302B2Light-emitting diode module
Publication Date: 2011.11.08 AU OPTRONICS CORP
  • US8052302B2 patent drawing
  • US8052302B2 patent drawing
  • US8052302B2 patent drawing

AI summary

An LED module including an LED light bar and a FPC is provided. The LED light bar includes a circuit board and a plurality of LED devices. The circuit board has a first surface, a second surface, first pins, second pins, and a slot. The LED devices are disposed on the first surface and electrically connected with the first pins. The FPC passes through the slot and is electrically connected with the second pins. The FPC includes a first bonding part, a second bonding part, and a bending part. The first bonding part has a plurality of third pins electrically connected with the second pins and is in contact with the first surface of the circuit board. The second bonding part has a plurality of fourth pins electrically connected with a control board. The bending part connects between the first part and the second part and passes through the slot.