LED Module Gap-Fill Insulating Film for Brightness and Precision
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Solution Overview
Problem
Current LED modules face challenges in achieving high brightness and compactness with efficient light emission, particularly in display devices, where separate backlights are often required, and there is a need for improved manufacturing processes to enhance mechanical reliability and optical performance.
Innovation Solution
The LED module incorporates a substrate with light emission windows, multiple LED cells with divided light emitting structures, a protective insulating film, a light blocking film, and a gap-fill insulating film to fill gaps between cells, along with a planarization layer and connection electrodes, enabling efficient light emission and improved mechanical reliability through a divided growth method and wafer bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If LED cells are densely arranged to achieve high brightness and compactness, then light emission efficiency improves, but manufacturing precision and mechanical reliability deteriorate due to gaps and misalignment
Solution Approach 1:
The patent applies preliminary action by forming a gap-fill insulating film before mounting the upper light emitting structure. This film pre-fills the gaps between lower light emitting structures, providing a preparatory foundation that ensures precise alignment and mechanical stability during subsequent manufacturing steps, thereby resolving the contradiction between dense arrangement and manufacturing precision
Solution Approach 2:
The gap-fill insulating film acts as an intermediary element between the lower and upper light emitting structures. It mediates the interface by filling gaps and providing a stable bonding surface, which maintains alignment precision while enabling dense arrangement of LED cells for high brightness output
2Illumination intensity
If separate backlight is used in LCD display, then light emission is achieved, but device complexity and space requirement increase
Solution Approach 1:
The patent merges the backlight function directly into the display panel structure by integrating LED cells with the panel substrate. The LED cells serve dual purposes as both light sources and structural elements, eliminating the need for a separate backlight unit and reducing overall device complexity while maintaining effective light emission
Solution Approach 2:
The LED cell structure is designed with multi-functionality, serving as both the light emitting element and the structural component of the display panel. This universal design eliminates redundant parts and simplifies the overall device architecture while achieving the required light emission performance
3Ease of manufacture
If conventional LED module fabrication is used, then manufacturing is straightforward, but production time and cost increase for high-resolution displays
Solution Approach 1:
The patent segments the light emitting structure into lower and upper portions that can be manufactured separately and then bonded together. This segmentation enables parallel processing and specialized manufacturing techniques for each segment, improving overall production efficiency for high-resolution displays while maintaining fabrication simplicity through modular assembly
Solution Approach 2:
The patent transitions from planar fabrication to three-dimensional stacked structure by bonding upper and lower light emitting structures vertically. This dimensional change enables higher pixel density and resolution without increasing lateral manufacturing complexity, thereby improving productivity for high-resolution displays
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in a compact, high-brightness LED module with enhanced light efficiency and mechanical reliability, allowing for the creation of high-resolution display modules with reduced manufacturing time and improved planarization process reliability.
Implementation Method 1
a gap-fill insulating film disposed on the protective insulating film to fill between the plurality of LED cells
Implementation Method 2
improved planarization process reliability through a divided growth method and wafer bonding process
Data Source
AI summary
An LED module includes light emission windows; LED cells corresponding to the light emission windows, the LED cells each including a lower and upper light emitting structure, the lower light emitting structure having an upper surface with first and second regions and having a first conductivity-type semiconductor layer, the upper light emitting structure being on the first region of the lower light emitting structure and having a second conductivity-type semiconductor layer, the LED cells including an active layer between the first and second conductivity-type semiconductor layers; a protective insulating film on a side surface of the lower light emitting structure and on the second region; a light blocking film on the protective insulating film, between the LED cells; a gap-fill insulating film on the protective insulating film between the LED cells and contacting a side surface of the upper light emitting structure; a first electrode; and a second electrode.