LED Module Groove Asymmetric Reflector Thermal Management
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Solution Overview
Problem
Existing LED illuminating devices for street illumination face high thermal resistance and limited light distribution due to multiple thermal interfaces and symmetrical point light sources, which are unfavorable for high-power LED applications.
Innovation Solution
An LED light-emitting module with a base board having grooves for directly mounting metal-based printed circuit boards with LED chips via COB process, incorporating an asymmetric reflector on the groove side walls for polarized light reflection and reduced thermal resistance, and encapsulating LED chips with silicone for improved durability and light efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple individually encapsulated LED chips are arranged in a matrix module, then high power illumination is achieved, but thermal resistance increases due to multiple thermal interfaces
Solution Approach 1:
The patent merges multiple LED chips onto a single printed circuit board substrate, eliminating the need for multiple separate encapsulated modules. This consolidation reduces the number of thermal interfaces from chip-to-lead-frame-and-solder-and-PCB to a direct chip-to-PCB mounting, significantly lowering thermal resistance while maintaining high power output capability
Solution Approach 2:
The invention extracts and eliminates the lead frame component from the thermal path. By directly mounting LED chips on the printed circuit board, the intermediate lead frame and its associated solder joints are removed, creating a more efficient thermal conduction path from the LED chips to the heat sink
2Power
If symmetrical point light sources are arranged in a matrix, then high power is achieved, but light distribution is limited to circular patterns
Solution Approach 1:
The patent employs asymmetrical reflector structures with different reflectivity coefficients on opposite sides, replacing the symmetrical arrangement of point light sources. This asymmetrical design enables flexible control of light distribution patterns, allowing adaptation to various street illumination requirements beyond circular patterns while maintaining high power output
3Adaptability or versatility
If a reflector layer is mechanically installed on the printed circuit board, then light distribution can be adjusted, but thermal resistance becomes too high
Solution Approach 1:
The patent merges the reflector structure with the printed circuit board into a single integrated component. The reflector is formed as an integral part of the PCB, eliminating the mechanical installation interface that created thermal resistance. This integration allows light distribution adjustment through reflector geometry design while maintaining efficient thermal conduction from LED chips through the PCB to the heat sink
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a simple, cost-effective LED module with low thermal resistance, enhanced luminescence efficiency, and polarized light distribution suitable for street illumination, improving thermal dissipation and light spot uniformity.
Implementation Method 1
Mounting high-power LED chips on the printed circuit board, especially on a metal-based circuit board, through the COB technology can advantageously avoid a thermal resistance caused by a lead frame and is thus favorable for thermal dissipation of the LED light-emitting module
Implementation Method 2
an asymmetric reflector arranged on the side wall of the groove can realize a polarized reflection to a predetermined direction
Implementation Method 3
encapsulating LED chips with silicone for improved durability and light efficiency
Data Source
Figure 1
Figure 2
Figure 3a~3b
AI summary
The present invention relates to an LED light-emitting module comprising: a base board (1) with at least one groove (2); at least one printed circuit board (3) with an array of LED chips (4), respectively arranged in the groove (2), wherein respective LED chips (4) are directly mounted on the printed circuit board (3) through a COB process, and the LED light-emitting module further comprising with a reflector (5) on a side wall of the groove (2) to reflect light from the LED chips (4). In addition, the present invention further relates to a method for manufacturing the LED light-emitting module. The LED light-emitting module according to the present invention can produce a polarizing effect, and therefore is particularly suited to the street illumination; moreover, the LED light-emitting module has the advantages of a simple structure, a low cost and a small thermal resistance.