LED Module Ground Lead for Three-Dimensional ESD Protection
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Solution Overview
Problem
Conventional LED modules provide limited protection against static electricity discharges in three-dimensional space, as the reduced size of circuit boards and narrower borders lead to incomplete grounding, allowing vertical or non-lateral static electricity discharges to damage LED chips.
Innovation Solution
The LED module incorporates a circuit board with driving signal wirings and ground wirings, featuring ground leads that are electrically insulated from signal leads and connected to the ground wiring, with extending parts designed to guide non-lateral static electricity to the ground terminal, ensuring effective discharge and reducing the risk of chip damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the circuit board size is reduced and borders are made narrower, then the display panel thickness is reduced, but the ground wiring cannot completely surround the LED package, reducing electrostatic protection effectiveness
Solution Approach 1:
The patent transitions from two-dimensional ground wiring arrangement on the circuit board to three-dimensional protection by adding ground leads that extend vertically from the LED package. This vertical extension allows the ground connection to reach beyond the circuit board plane, providing protection against vertically discharged static electricity while maintaining a compact circuit board layout.
2Device complexity
If the ground wiring is arranged only on the edges of the circuit board, then the circuit board layout is simplified, but static electricity discharged along the vertical direction can enter the LED package through signal leads
Solution Approach 1:
The patent divides the grounding system into two functional segments: ground wiring on the circuit board for lateral static electricity discharge, and ground leads extending from the LED package for vertical discharge. This segmentation allows each component to address specific discharge directions, providing comprehensive protection while maintaining simple circuit board layout.
Solution Approach 2:
The ground lead acts as an intermediary element that bridges the LED package and the ground wiring. It provides a dedicated low-resistance path for static electricity to reach ground without passing through signal leads, thereby protecting the LED chip from electrostatic damage.
3Ease of manufacture
If conventional ground wiring is used, then the circuit board design is simple, but it provides only two-dimensional protection and cannot prevent damage from vertically discharged static electricity
Solution Approach 1:
The patent extends the grounding system into the third dimension by adding vertical ground leads that protrude from the LED package. This creates a three-dimensional protection zone that intercepts statically charged particles approaching from any direction, not just those traveling horizontally across the circuit board plane.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances electrostatic discharge protection by providing a lower resistance path for non-lateral static electricity, reducing the likelihood of damage to the LED chip and offering improved three-dimensional protection against static electricity.
Implementation Method 1
The ground lead is electrically insulated from the signal lead and is electrically connected to the ground wiring
Implementation Method 2
The static electricity discharges electricity to an LED package through lower resistance routes
Data Source
AI summary
A light emitting diode (LED) module including a circuit board and at least one LED package is provided. The circuit board has a plurality of driving signal wirings and at least one ground wiring. The LED package is disposed on the circuit board and is electrically connected to the driving signal wirings. The LED package includes at least one LED chip, a plurality of signal leads, and at least one ground lead. The signal leads are electrically connected to the LED chip. The ground lead is electrically insulated from the signal lead and is electrically connected to the ground wiring. The ground lead is electrically insulated from the LED chip and has favorable electrostatic discharge (ESD) protection performance.