LED Light Source Module Layout for Heat Dissipation and Phosphor Reliability
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Solution Overview
Problem
Existing light source modules for vehicles face challenges in effectively dissipating heat generated by high-intensity LED packages, leading to increased ambient temperatures and potential degradation of wavelength conversion materials, while also requiring improved structural and optical reliability.
Innovation Solution
A light source module design featuring a substrate with a heat dissipation pad spaced apart from lower electrodes, an air path along the side surfaces, and specific ratios between the wavelength conversion portion and heat dissipation pad dimensions to enhance heat dissipation and structural adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional LED package structure with electrodes extending to package corners is used, then the packaging process is simplified, but the LED chip cannot be properly positioned and fixed on the substrate
Solution Approach 1:
The electrode structure is segmented into functional zones: signal electrodes (first and second electrodes) for electrical connection and a separate ground electrode (third electrode) for positioning and grounding. This segmentation allows the ground electrode to extend to package corners for precise LED chip positioning while signal electrodes maintain controlled lengths for proper soldering, resolving the contradiction between manufacturing simplicity and positioning precision.
2Manufacturing precision
If signal electrodes are extended to package corners for proper LED chip positioning, then positioning precision improves, but soldering becomes difficult due to electrode overlap
Solution Approach 1:
The electrode system is divided into signal electrodes with controlled lengths that do not extend to package corners, and a separate ground electrode that extends to corners for positioning. This prevents soldering interference while maintaining positioning precision through the ground electrode's corner extension and the positioning protrusion structure.
Solution Approach 2:
A positioning protrusion structure is introduced as an intermediary element between the ground electrode and the LED chip. This positioning protrusion extends from the ground electrode to the package corner, providing precise positioning without requiring signal electrodes to extend to corners, thereby avoiding soldering difficulties while maintaining positioning accuracy.
3Power
If the entire lower surface of the substrate is used for electrodes, then electrical connection is maximized, but heat dissipation capability is reduced
Solution Approach 1:
The substrate surface is assigned different local functions: signal electrodes and ground electrodes occupy specific regions for electrical connection, while a dedicated heat dissipation region remains electrode-free for thermal management. The ground electrode's positioning protrusion extends to package corners without compromising the heat dissipation region, achieving both maximized electrical connection and optimized heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves heat dissipation, structural reliability, and optical reliability by concentrating light and preventing degradation of wavelength conversion materials, while maintaining component adhesion.
Implementation Method 1
a light emitting structure disposed on an upper surface of the first upper electrode and electrically connected to the first and second upper electrodes
Implementation Method 2
a light emitting structure disposed on an upper surface of the first upper electrode and electrically connected to the first and second upper electrodes
Implementation Method 3
a wavelength conversion portion disposed corresponding to a light emitting region on an upper surface of the light emitting structure
Data Source
Figure 1~2A
Figure 2B~2C
Figure 2D~2E
AI summary
A light source module according to the present invention includes a light emitting diode package, which includes a substrate, a first upper electrode and a second upper electrode disposed on an upper surface of the substrate, a light emitting structure disposed on an upper surface of the first upper electrode and electrically connected to the first and second upper electrodes, and a wavelength conversion portion disposed corresponding to a light emitting region on an upper surface of the light emitting structure, a first lower electrode and a second lower electrode disposed on a lower surface of the substrate and electrically connected to the first and second upper electrodes, respectively, and a heat dissipation pad disposed on a lower surface of the substrate to be spaced apart from the first and second lower electrodes.