LED Module Heat Dissipation via Settled Phosphor Layer
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Solution Overview
Problem
Existing LED modules optimized for homogeneous light emission lack effective thermal management, leading to poor heat dissipation and efficiency issues, particularly in small sizes where inadequate heat dissipation can negatively impact light emission and service life.
Innovation Solution
An LED module with a casting compound containing color conversion particles applied using a settlement process, where the compound has a defined height and increased thermal conductivity, allowing for improved heat dissipation through targeted thermal conductivity and reduced thermal resistance between the color conversion particles and the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the LED module is made small to reduce mounting space, then the module size is reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The casting compound is formulated with specific thermal conductivity properties (0.1-1.5 W/mK) to optimize heat dissipation locally within the module. The compound contains phosphor particles with controlled concentration (0.1-5% by weight) and specific size distributions to create optimal thermal pathways from the LED chip to the heat sink, enabling effective heat management in compact dimensions.
2Illumination intensity
If phosphor particles are settled to achieve homogeneous light emission, then light emission homogeneity is improved, but thermal management capability deteriorates
Solution Approach 1:
The patent optimizes multiple parameters of the casting compound simultaneously: thermal conductivity (0.1-1.5 W/mK), phosphor particle concentration (0.1-5% by weight), particle size distribution (0.1-10 µm), and viscosity (10-1000 mPa·s). These parameter changes enable the compound to achieve both homogeneous phosphor distribution for uniform light emission and adequate thermal conductivity for effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation and efficiency, enabling higher light output with a smaller module size, potentially eliminating the need for active cooling and optimizing thermal management.
Implementation Method 1
the blue light emitted by the LED chip is at least partially converted into light of a different wavelength by the color conversion particles
Implementation Method 2
the color conversion particles in the sealing compound have settled onto the surface of the LED chip under the influence of gravity
Implementation Method 3
the potting compound is designed in such a way that it has a thermal conductivity between 0.1 and 1.5 W/mK, preferably between 0.1 and 0.3 W/mK
Data Source
Figure 1a~1b
Figure 2a
Figure 2b
AI summary
LED module (10) comprising a substrate (1) and at least one LED chip (2), which is arranged on a surface (1a) of the substrate, a potting compound (3), which is arranged over the LED chip (2), comprises sedimented colour conversion particles (3a) contained therein and extends to a defined height (h) from an upper side (2a) of the LED chip (2) that is facing away from the substrate, wherein the colour conversion particles (3a) form within the potting compound (3) a layer (4) which covers an upper side (2a) of the LED chip (2) that is facing away from the substrate and the surface (1b) of the substrate (1) that surrounds the LED chip, wherein the height (h) of the potting compound over the at least one LED chip is between 0.3 and 1.4 mm, and wherein the potting compound is formed such that it has a thermal conductivity of between 0.1 and 1.5 W/mK.